Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381177 | Package structure and method of fabricating the same | Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih | 2025-08-05 |
| 12119324 | Package structure | Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih | 2024-10-15 |
| 11990429 | Dummy die placement without backside chipping | Chih-Wei Wu, Ying-Ching Shih, Li-Chung Kuo, Pu Wang, Szu-Wei Lu | 2024-05-21 |
| 11948896 | Package structure | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2024-04-02 |
| 11515267 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2022-11-29 |
| 11508692 | Package structure and method of fabricating the same | Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih | 2022-11-22 |
| 11476205 | Package structure and method for forming the same | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2022-10-18 |
| 11164824 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Li-Chung Kuo, Szu-Wei Lu, Ying-Ching Shih | 2021-11-02 |
| 10923438 | Package structure and method for forming the same | Tsung-Fu Tsai, I-Ting Huang, Shih-Ting Lin, Szu-Wei Lu | 2021-02-16 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang +2 more | 2020-12-22 |
| 10861799 | Dummy die placement without backside chipping | Chih-Wei Wu, Li-Chung Kuo, Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2020-12-08 |
| 10269731 | Apparatus for dicing interposer assembly | Chung Yu Wang, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2019-04-23 |
| 9793187 | 3D packages and methods for forming the same | Shih-Ting Lin, Szu-Wei Lu, Jing-Cheng Lin | 2017-10-17 |
| 9337063 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Chung Yu Wang +2 more | 2016-05-10 |
| 9111912 | 3D packages and methods for forming the same | Shih-Ting Lin, Szu-Wei Lu, Jing-Cheng Lin | 2015-08-18 |
| 8946893 | Apparatus for dicing interposer assembly | Chung Yu Wang, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2015-02-03 |
| 8772929 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Chung Yu Wang +2 more | 2014-07-08 |
| 8629043 | Methods for de-bonding carriers | Chung Yu Wang, Jui-Pin Hung, Chih-Hao Chen, Chun-Hsing Su, Yi-Chao Mao +7 more | 2014-01-14 |
| 8501590 | Apparatus and methods for dicing interposer assembly | Chung Yu Wang, Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin | 2013-08-06 |