Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347817 | Semiconductor device package having warpage control | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2025-07-01 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12261125 | Method for forming chip package structure | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2025-03-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2024-06-18 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2024-05-07 |
| 11804445 | Method for forming chip package structure | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2023-10-31 |
| 11764123 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-09-19 |
| 11694939 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-07-04 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2021-08-24 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Yushun Lin, Shu-Chia Hsu +2 more | 2020-12-22 |