Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412827 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-09-09 |
| 12368092 | Package substrate insulation opening design | Shu-Jung Tseng | 2025-07-22 |
| 12354884 | Method for making a packaging substrate | Kuo-Ching Hsu | 2025-07-08 |
| 12354928 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2025-07-08 |
| 12347817 | Semiconductor device package having warpage control | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2025-07-01 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-05-13 |
| 12261125 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2025-03-25 |
| 12230593 | Wafer level package with polymer layer delamination prevention design and method of forming the same | Kai-Heng CHEN, Pei-Haw Tsao, Rung-De Wang, Chien-Chun Wang | 2025-02-18 |
| 11996346 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2024-05-28 |
| 11978729 | Semiconductor device package having warpage control and method of forming the same | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2024-05-07 |
| 11854956 | Semiconductor die package with conductive line crack prevention design | Ya Huei Lee, Shu-Shen Yeh, Kuo-Ching Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11817382 | Package substrate insulation opening design | Shu-Jung Tseng | 2023-11-14 |
| 11804445 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Pei-Haw Tsao | 2023-10-31 |
| 11699631 | Semiconductor device and manufacturing method thereof | Shu-Shen Yeh, Po-Yao Lin, Hui Yu, Shin-Puu Jeng | 2023-07-11 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2022-08-09 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11251114 | Package substrate insulation opening design | Shu-Jung Tseng | 2022-02-15 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2020-10-06 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shin-Puu Jeng | 2018-12-25 |
| 10109547 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2018-10-23 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Po-Yao Lin, Cheng-Lin Huang, Shin-Puu Jeng | 2018-01-30 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng +2 more | 2018-01-16 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin +4 more | 2017-08-29 |