Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374600 | Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same | Wei-Teng Chang, Meng-Tsung KUO, Hui Yu | 2025-07-29 |
| 11978715 | Structure and formation method of chip package with protective lid | Meng-Tsung KUO, Hui Yu, Wei-Teng Chang | 2024-05-07 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Tsung-Ming Yeh | 2022-05-10 |
| 10727147 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Tsung-Ming Yeh | 2020-07-28 |
| 10109547 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Tsung-Ming Yeh | 2018-10-23 |
| 9451694 | Package substrate structure | Wei-Jen Lai, Wen-Chun Liu | 2016-09-20 |
| 8468888 | MEMS sensor capable of sensing acceleration and pressure | Ming-Ching Wu, Jeff BIAR, Kazuhiro Okada | 2013-06-25 |
| 7737452 | Light-emitting element package and light source apparatus using the same | Jin-Chyuan Biar, Jue Huang | 2010-06-15 |
| 7675159 | Base substrate for chip scale packaging | Jeff BIAR | 2010-03-09 |
| 7122124 | Method of fabricating film carrier | Dyi-Chung Hu, Chien-Nan Wu | 2006-10-17 |
| 6677055 | Tape structure and manufacturing method | Chin-Fu Chung | 2004-01-13 |
| 6521521 | Bonding pad structure and method for fabricating the same | Ying-Chih Chen | 2003-02-18 |
| 6392305 | Chip scale package of semiconductor | Shu-Hua Tseng | 2002-05-21 |
| 6344687 | Dual-chip packaging | Shu-Hua Tseng | 2002-02-05 |
| 6262475 | Lead frame with heat slug | Wen-Chun Liu | 2001-07-17 |
| 6215176 | Dual leadframe package | — | 2001-04-10 |
| 6177719 | Chip scale package of semiconductor | Shu-Hua Tseng | 2001-01-23 |
| 6078099 | Lead frame structure for preventing the warping of semiconductor package body | Wen-Chun Liu, Jung-Jie Liou | 2000-06-20 |
| 5994767 | Leadframe for integrated circuit package and method of manufacturing the same | Wei-Jen Lai | 1999-11-30 |
| 5889317 | Leadframe for integrated circuit package | Wei-Jen Lai | 1999-03-30 |
| 5882955 | Leadframe for integrated circuit package and method of manufacturing the same | Wei-Jen Lai | 1999-03-16 |
| 5188986 | Hydrogen peroxide in basic solution to clean polycrystalline silicon after phosphorous diffusion | Wei Liu, Chad CHEN | 1993-02-23 |