Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374600 | Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same | Wei-Teng Chang, Chih-Kung Huang, Hui Yu | 2025-07-29 |
| 11978715 | Structure and formation method of chip package with protective lid | Hui Yu, Chih-Kung Huang, Wei-Teng Chang | 2024-05-07 |