Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374600 | Dam structure on lid to constrain a thermal interface material in a semiconductor device package structure and methods for forming the same | Meng-Tsung KUO, Chih-Kung Huang, Hui Yu | 2025-07-29 |
| 11978715 | Structure and formation method of chip package with protective lid | Meng-Tsung KUO, Hui Yu, Chih-Kung Huang | 2024-05-07 |
| 10068830 | Compressible thermal interface materials | Liang Zeng, Ya Qun Liu, Liqiang Zhang, Zhe Ding, Wei-Jun Wang +1 more | 2018-09-04 |
| 7840819 | Automatic switch method and apparatus for a USB | Wei-Che Chiu, Li-Wei Lee | 2010-11-23 |