Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6204553 | Lead frame structure | Wen-Chun Liu, Hui Liu, Yi Pan, Sheng-Tung Tsai | 2001-03-20 |
| 6078099 | Lead frame structure for preventing the warping of semiconductor package body | Wen-Chun Liu, Chih-Kung Huang | 2000-06-20 |