Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2021-01-12 |
| 10566215 | Method of fabricating a chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2020-02-18 |
| 10424494 | Chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2019-09-24 |
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz | 2018-10-02 |
| 9583408 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Marcus E. Interrante, Hilton T. Toy, Jeffrey A. Zitz | 2017-02-28 |
| 9437515 | Heat spreading layer with high thermal conductivity | Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Kamal K. Sikka, Jeffrey A. Zitz | 2016-09-06 |
| 6486564 | Heat dissipation module for a BGA IC | Wen-Chun Liu, Kuo-Yuan Lee | 2002-11-26 |
| 6204553 | Lead frame structure | Wen-Chun Liu, Hui Liu, Jung-Jie Liou, Sheng-Tung Tsai | 2001-03-20 |