Yi Pan — 8 Patents at IBM | Patent Leaderboard

Yi Pan has been granted 8 US patents while listed as an inventor at IBM. The first was granted in 2001 and the most recent in January 2021. Yi Pan ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Yi Pan in Poughkeepsie, NY, US.

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10892170	Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader	Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz	2021-01-12	$3,912,000
10566215	Method of fabricating a chip module with stiffening frame and orthogonal heat spreader	Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz	2020-02-18	$2,353,000
10424494	Chip module with stiffening frame and orthogonal heat spreader	Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz	2019-09-24	$3,094,000
10090173	Method of fabricating a chip module with stiffening frame and directional heat spreader	Evan G. Colgan, Hilton T. Toy, Jeffrey A. Zitz	2018-10-02	$3,730,000
9583408	Reducing directional stress in an orthotropic encapsulation member of an electronic package	Marcus E. Interrante, Hilton T. Toy, Jeffrey A. Zitz	2017-02-28	$2,397,000
9437515	Heat spreading layer with high thermal conductivity	Evan G. Colgan, Taryn J. Davis, Chenzhou Lian, Kamal K. Sikka, Jeffrey A. Zitz	2016-09-06	$4,975,000
6486564	Heat dissipation module for a BGA IC	Wen-Chun Liu, Kuo-Yuan Lee	2002-11-26
6204553	Lead frame structure	Wen-Chun Liu, Hui Liu, Jung-Jie Liou, Sheng-Tung Tsai	2001-03-20

Yi Pan — 8 Patents

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