Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431404 | Fatigue failure resistant electronic package | Shidong Li, Tuhin Sinha, Jeffrey A. Zitz | 2025-09-30 |
| 12319781 | Rehealable and reworkable polymer for electronic packaging | Rudy J. Wojtecki, Gregory Breyta, Teddie Peregrino Magbitang | 2025-06-03 |
| 12183702 | Electronic package with varying interconnects | Charles L. Arvin, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill, Steven L. Wright | 2024-12-31 |
| 11887908 | Electronic package structure with offset stacked chips and top and bottom side cooling lid | Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K. Bonam | 2024-01-30 |
| 11825592 | Electronic device console with natural draft cooling | Chenzhou Lian, Kathryn C. Rivera, Paul F. Bodenweber, Jon A. Casey | 2023-11-21 |
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron +8 more | 2023-10-17 |
| 11527462 | Circuit substrate with mixed pitch wiring | Katsuyuki Sakuma, Shidong Li | 2022-12-13 |
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11410905 | Optimized weight heat spreader for an electronic package | Kenneth C. Marston, Tuhin Sinha, Shidong Li | 2022-08-09 |
| 11302651 | Laminated stiffener to control the warpage of electronic chip carriers | Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2022-04-12 |
| 11264306 | Hybrid TIMs for electronic package cooling | Piyas Bal Chowdhury, James J. Kelly, Jeffrey A. Zitz, Sushumna Iruvanti, Shidong Li | 2022-03-01 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2021-11-16 |
| 11164817 | Multi-chip package structures with discrete redistribution layers | Joshua M. Rubin, Steven L. Wright, Lawrence A. Clevenger | 2021-11-02 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Paul S. Andry, Yang Liu, Pascale Gagnon, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
| 11101191 | Laminated circuitry cooling for inter-chip bridges | Hiroyuki Mori | 2021-08-24 |
| 11081424 | Micro-fluidic channels having various critical dimensions | Ravi K. Bonam, Joshua M. Rubin, Iqbal Rashid Saraf, Fee Li Lie | 2021-08-03 |
| 11056418 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2021-07-06 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Ravi K. Bonam, Mukta G. Farooq, Dinesh Gupta, James J. Kelly, Joshua M. Rubin | 2021-06-29 |
| 11049789 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2021-06-29 |
| 11035625 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2021-06-15 |
| 10991635 | Multiple chip bridge connector | Dale Curtis McHerron, Joshua M. Rubin, Ravi K. Bonam, Ramachandra Divakaruni, William J. Starke +1 more | 2021-04-27 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2021-04-13 |
| 10948247 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2021-03-16 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2021-03-02 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2021-01-26 |