Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10834808 | Electronic device console with natural draft cooling | Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera | 2020-11-10 |
| 10825821 | Cooling and power delivery for a wafer level computing board | Babar A. Khan, Arvind Kumar | 2020-11-03 |
| 10757833 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-08-25 |
| 10665524 | Electronic package cover having underside rib | Krishna R. Tunga | 2020-05-26 |
| 10636746 | Method of forming an electronic package | Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti | 2020-04-28 |
| 10622275 | Electronic package cover having underside rib | Krishna R. Tunga | 2020-04-14 |
| 10607928 | Reduction of laminate failure in integrated circuit (IC) device carrier | Anson J. Call, Sushumna Iruvanti, Shidong Li, Brian W. Quinlan, Rui Wang | 2020-03-31 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2020-03-17 |
| 10584924 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2020-03-10 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2020-03-03 |
| 10566313 | Integrated circuit chip carrier with in-plane thermal conductance layer | Shidong Li | 2020-02-18 |
| 10553516 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2020-02-04 |
| 10553522 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie | 2020-02-04 |
| 10541156 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2020-01-21 |
| 10542636 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2020-01-21 |
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Donald F. Canaperi, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Donald F. Canaperi, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10424527 | Electronic package with tapered pedestal | Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2019-09-24 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2019-06-25 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Hilton T. Toy, Randall J. Werner, Jeffrey A. Zitz | 2019-01-01 |
| 10088244 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2018-10-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Hilton T. Toy, Jeffrey A. Zitz | 2018-04-17 |
| 9921008 | Adjustable heat sink fin spacing | Paul F. Bodenweber | 2018-03-20 |