Issued Patents All Time
Showing 76–85 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7768121 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Jeffrey D. Gelorme, Hilton T. Toy, Jeffrey A. Zitz | 2010-08-03 |
| 7733655 | Lid edge capping load | Martin Beaumier, Mohamed Belazzouz, Peter J. Brofman, David L. Edwards, Jiantao Zheng +1 more | 2010-06-08 |
| 7516776 | Microjet module assembly | Raschid J. Bezama, Govindarajan Natarajan, Hilton T. Toy | 2009-04-14 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Hilton T. Toy, Jamil A. Wakil | 2009-02-10 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Hilton T. Toy, Jamil A. Wakil | 2008-01-15 |
| 7288839 | Apparatus and methods for cooling semiconductor integrated circuit package structures | Evan G. Colgan, Jeffrey D. Gelorme, Hilton T. Toy, Jeffrey A. Zitz | 2007-10-30 |
| 7250576 | Chip package having chip extension and method | Evan G. Colgan, David L. Edwards, Benjamin V. Fasano, Jeffrey A. Zitz, Wei Zou | 2007-07-31 |
| 7031162 | Method and structure for cooling a dual chip module with one high power chip | Amilcar R. Arvelo, Hilton T. Toy | 2006-04-18 |
| 6294408 | Method for controlling thermal interface gap distance | David L. Edwards, Michael Emmett, Sushumna Iruvanti, Raed A. Sherif, Hilton T. Toy | 2001-09-25 |
| 6292367 | Thermally efficient semiconductor chip | John U. Knickerbocker, Subhash L. Shinde | 2001-09-18 |