Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9943936 | Overmolded dual in-line memory module cooling structure | Michael A. Boraas, Vinod Kamath, Michael S. Miller, Mark E. Steinke | 2018-04-17 |
| 8900503 | Method of forming an overmolded dual in-line memory module cooling structure | Michael A. Boraas, Vinod Kamath, Michael S. Miller, Mark E. Steinke | 2014-12-02 |
| 8299608 | Enhanced thermal management of 3-D stacked die packaging | Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Xiaojin Wei, Jiantao Zheng | 2012-10-30 |
| 8037594 | Method of forming a flip-chip package | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy | 2011-10-18 |
| 7982475 | Structure and method for reliability evaluation of FCPBGA substrates for high power semiconductor packaging applications | David J. Russell, Ronald Malfatt, Stefano S. Oggioni | 2011-07-19 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, John Harold Magerlein, Kenneth C. Marston, Kathryn C. Rivera +3 more | 2011-04-19 |
| 7698114 | Techniques for distributing power in electronic circuits and computer systems | Hendrik F. Hamann, James A. Lacey, Alan J. Weger | 2010-04-13 |
| 7489512 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy | 2009-02-10 |
| 7319591 | Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages | Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy | 2008-01-15 |
| 7167806 | Method and system for measuring temperature and power distribution of a device | Hendrik F. Hamann, James A. Lacey, Martin P. O'Boyle, Robert J. von Gutfeld, Alan J. Weger | 2007-01-23 |
| 6829144 | Flip chip package with heat spreader allowing multiple heat sink attachment | Randall J. Stutzman | 2004-12-07 |
| 6793123 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Randall J. Stutzman | 2004-09-21 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs | Varaprasad V. Calmidi, Krishna Darbha, Sanjeev Sathe | 2003-09-23 |
| 6541847 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Eric A. Johnson, Randall J. Stutzman | 2003-04-01 |