| 8772927 |
Semiconductor package structures having liquid cooler integrated with first level chip package modules |
Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Xiaojin Wei |
2014-07-08 |
$4,236,000 |
| 8581392 |
Silicon based microchannel cooling and electrical package |
John U. Knickerbocker |
2013-11-12 |
$8,268,000 |
| 8505617 |
Structure and apparatus for cooling integrated circuits using copper microchannels |
Raschid J. Bezama, Evan G. Colgan, Madhusudan K. Iyengar, Roger R. Schmidt |
2013-08-13 |
$10,067,000 |
| 8418751 |
Stacked and redundant chip coolers |
Raschid J. Bezama, Evan G. Colgan |
2013-04-16 |
$3,567,000 |
| 8421220 |
Silicon based microchannel cooling and electrical package |
John U. Knickerbocker |
2013-04-16 |
$3,567,000 |
| 8210243 |
Structure and apparatus for cooling integrated circuits using cooper microchannels |
Raschid J. Bezama, Evan G. Colgan, Madhusudan K. Iyengar, Roger R. Schmidt |
2012-07-03 |
$4,930,000 |
| 8115303 |
Semiconductor package structures having liquid coolers integrated with first level chip package modules |
Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Xiaojin Wei |
2012-02-14 |
$8,403,000 |
| 8110415 |
Silicon based microchannel cooling and electrical package |
John U. Knickerbocker |
2012-02-07 |
$8,176,000 |
| 8097492 |
Method and manufacture of silicon based package and devices manufactured thereby |
Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller |
2012-01-17 |
$12,258,000 |
| 7990711 |
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate |
Paul S. Andry, Thomas J. Brunschwiler, Evan G. Colgan |
2011-08-02 |
$4,890,000 |
| 7928562 |
Segmentation of a die stack for 3D packaging thermal management |
Amilcar R. Arvelo, Evan G. Colgan, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka +3 more |
2011-04-19 |
$4,236,000 |
| 7880305 |
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer |
Yu-Ting Cheng, Sherif A. Goma, Sampath Purushothaman, Carlos J. Sambucetti, George F. Walker |
2011-02-01 |
$3,711,000 |
| 7855442 |
Silicon based package |
Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller |
2010-12-21 |
$6,138,000 |
| 7829427 |
Method of fabricating a high Q factor integrated circuit inductor |
Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Kevin S. Petrarca +2 more |
2010-11-09 |
$6,046,000 |
| 7808781 |
Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements |
Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Roger R. Schmidt, Hilton T. Toy |
2010-10-05 |
$4,341,000 |
| 7808798 |
Versatile Si-based packaging with integrated passive components for mmWave applications |
John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more |
2010-10-05 |
$4,341,000 |
| 7638406 |
Method of fabricating a high Q factor integrated circuit inductor |
Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Kevin S. Petrarca +2 more |
2009-12-29 |
$22,760,000 |
| 7581314 |
Method of forming noble metal contacts |
Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more |
2009-09-01 |
$20,741,000 |
| 7518229 |
Versatile Si-based packaging with integrated passive components for mmWave applications |
John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more |
2009-04-14 |
$4,368,000 |
| 7473102 |
Space transforming land grid array interposers |
Evan G. Colgan, Paul W. Coteus, Hubert Harrer, Gareth G. Hougham, John G. Torok |
2009-01-06 |
$2,860,000 |
| 7202764 |
Noble metal contacts for micro-electromechanical switches |
Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more |
2007-04-10 |
$7,482,000 |
| 7189595 |
Method of manufacture of silicon based package and devices manufactured thereby |
Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller |
2007-03-13 |
$7,068,000 |
| 7190580 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
Raschid J. Bezama, Evan G. Colgan, Roger R. Schmidt |
2007-03-13 |
$7,068,000 |
| 7139172 |
Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages |
Raschid J. Bezama, Evan G. Colgan, Roger R. Schmidt |
2006-11-21 |
$6,127,000 |
| 7128472 |
Method and apparatus for providing optoelectronic communication with an electronic device |
Alan F. Benner, Evan G. Colgan, How T. Lin, Frank L. Pompeo, Subhash L. Shinde +1 more |
2006-10-31 |
$4,068,000 |
