Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8772927 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Xiaojin Wei | 2014-07-08 |
| 8581392 | Silicon based microchannel cooling and electrical package | John U. Knickerbocker | 2013-11-12 |
| 8505617 | Structure and apparatus for cooling integrated circuits using copper microchannels | Raschid J. Bezama, Evan G. Colgan, Madhusudan K. Iyengar, Roger R. Schmidt | 2013-08-13 |
| 8418751 | Stacked and redundant chip coolers | Raschid J. Bezama, Evan G. Colgan | 2013-04-16 |
| 8421220 | Silicon based microchannel cooling and electrical package | John U. Knickerbocker | 2013-04-16 |
| 8210243 | Structure and apparatus for cooling integrated circuits using cooper microchannels | Raschid J. Bezama, Evan G. Colgan, Madhusudan K. Iyengar, Roger R. Schmidt | 2012-07-03 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Raschid J. Bezama, Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Xiaojin Wei | 2012-02-14 |
| 8110415 | Silicon based microchannel cooling and electrical package | John U. Knickerbocker | 2012-02-07 |
| 8097492 | Method and manufacture of silicon based package and devices manufactured thereby | Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller | 2012-01-17 |
| 7990711 | Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate | Paul S. Andry, Thomas J. Brunschwiler, Evan G. Colgan | 2011-08-02 |
| 7928562 | Segmentation of a die stack for 3D packaging thermal management | Amilcar R. Arvelo, Evan G. Colgan, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka +3 more | 2011-04-19 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, Sherif A. Goma, Sampath Purushothaman, Carlos J. Sambucetti, George F. Walker | 2011-02-01 |
| 7855442 | Silicon based package | Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller | 2010-12-21 |
| 7829427 | Method of fabricating a high Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Kevin S. Petrarca +2 more | 2010-11-09 |
| 7808781 | Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements | Evan G. Colgan, Michael A. Gaynes, Kenneth C. Marston, Roger R. Schmidt, Hilton T. Toy | 2010-10-05 |
| 7808798 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2010-10-05 |
| 7638406 | Method of fabricating a high Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, Kevin S. Petrarca +2 more | 2009-12-29 |
| 7581314 | Method of forming noble metal contacts | Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more | 2009-09-01 |
| 7518229 | Versatile Si-based packaging with integrated passive components for mmWave applications | John M. Cotte, Brian P. Gaucher, Janusz Grzyb, Nils D. Hoivik, Christopher V. Jahnes +5 more | 2009-04-14 |
| 7473102 | Space transforming land grid array interposers | Evan G. Colgan, Paul W. Coteus, Hubert Harrer, Gareth G. Hougham, John G. Torok | 2009-01-06 |
| 7202764 | Noble metal contacts for micro-electromechanical switches | Hariklia Deligianni, Panayotis Andricacos, L. Paivikki Buchwalter, John M. Cotte, Christopher V. Jahnes +5 more | 2007-04-10 |
| 7189595 | Method of manufacture of silicon based package and devices manufactured thereby | Chirag S. Patel, Edmund J. Sprogis, Herbert I. Stoller | 2007-03-13 |
| 7190580 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Raschid J. Bezama, Evan G. Colgan, Roger R. Schmidt | 2007-03-13 |
| 7139172 | Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages | Raschid J. Bezama, Evan G. Colgan, Roger R. Schmidt | 2006-11-21 |
| 7128472 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, Evan G. Colgan, How T. Lin, Frank L. Pompeo, Subhash L. Shinde +1 more | 2006-10-31 |