| 8097492 |
Method and manufacture of silicon based package and devices manufactured thereby |
John Harold Magerlein, Chirag S. Patel, Edmund J. Sprogis |
2012-01-17 |
| 7855442 |
Silicon based package |
John Harold Magerlein, Chirag S. Patel, Edmund J. Sprogis |
2010-12-21 |
| 7193318 |
Multiple power density chip structure |
Evan G. Colgan, George A. Katopis, Chandrashekhar Ramaswamy |
2007-03-20 |
| 7189595 |
Method of manufacture of silicon based package and devices manufactured thereby |
John Harold Magerlein, Chirag S. Patel, Edmund J. Sprogis |
2007-03-13 |
| 6974722 |
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
Glenn G. Daves, Jason L. Frankel, William F. Shutler, Anthony Wayne Sigler, John Vetrero +1 more |
2005-12-13 |
| 6878608 |
Method of manufacture of silicon based package |
Peter J. Brofman, Glenn G. Daves, Sudipta K. Ray |
2005-04-12 |
| 6762489 |
Jogging structure for wiring translation between grids with non-integral pitch ratios in chip carrier modules |
Glenn G. Daves, Jason L. Frankel, William F. Shutler, Anthony Wayne Sigler, John Vetrero +1 more |
2004-07-13 |
| 6713686 |
Apparatus and method for repairing electronic packages |
Wiren D. Becker, Dinesh Gupta, Sudipta K. Ray, Robert A. Rita, Kathleen M. Wiley |
2004-03-30 |
| 6430030 |
High k dielectric material with low k dielectric sheathed signal vias |
Mukta S. Farooq, Harvey C. Hamel, Robert A. Rita |
2002-08-06 |
| 6392896 |
Semiconductor package containing multiple memory units |
— |
2002-05-21 |
| 6261467 |
Direct deposit thin film single/multi chip module |
Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Lisa M. Studzinski +1 more |
2001-07-17 |
| 6216324 |
Method for a thin film multilayer capacitor |
Mukta S. Farooq, Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita |
2001-04-17 |
| 6200400 |
Method for making high k dielectric material with low k dielectric sheathed signal vias |
Mukta S. Farooq, Harvey C. Hamel, Robert A. Rita |
2001-03-13 |
| 6072690 |
High k dielectric capacitor with low k sheathed signal vias |
Mukta S. Farooq, Harvey C. Hamel, Robert A. Rita |
2000-06-06 |
| 6037044 |
Direct deposit thin film single/multi chip module |
Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Lisa M. Studzinski +1 more |
2000-03-14 |
| 6023407 |
Structure for a thin film multilayer capacitor |
Mukta S. Farooq, Shaji Farooq, Harvey C. Hamel, John U. Knickerbocker, Robert A. Rita |
2000-02-08 |
| 5635761 |
Internal resistor termination in multi-chip module environments |
Tai A. Cao, Thanh D. Trinh, Lloyd A. Walls |
1997-06-03 |
| 5243140 |
Direct distribution repair and engineering change system |
Harsaran S. Bhatia, Mario J. Interrante, Suresh D. Kadakia, Shashi D. Malaviya, Mark H. McLeod +1 more |
1993-09-07 |
| 5060116 |
Electronics system with direct write engineering change capability |
Warren D. Grobman, Charles J. Kraus, by Paula A. Kraus, executrix, Leon L. Wu |
1991-10-22 |
| 4688151 |
Multilayered interposer board for powering high current chip modules |
Charles J. Kraus, Leon L. Wu |
1987-08-18 |
| 4546413 |
Engineering change facility on both major surfaces of chip module |
Irving Feinberg, Charles J. Kraus |
1985-10-08 |
| 4535388 |
High density wired module |
Charles J. Kraus, Leon L. Wu |
1985-08-13 |
| 4252581 |
Selective epitaxy method for making filamentary pedestal transistor |
Narasipur G. Anantha, Joseph R. Cavaliere, Richard R. Konian, Gurumakonda R. Srinivasan, James L. Walsh |
1981-02-24 |
