Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9433105 | Method of fabricating printed circuit boards | Richard S. Graf, Thomas E. Lombardi, David J. West | 2016-08-30 |
| 8466543 | Three dimensional stacked package structure | Thomas J. Fleischman, Eric D. Perfecto | 2013-06-18 |
| 8450849 | Robust FBEOL and UBM structure of C4 interconnects | Minhua Lu, Eric D. Pefecto, David L. Questad | 2013-05-28 |
| 8304290 | Overcoming laminate warpage and misalignment in flip-chip packages | Richard S. Graf, Thomas E. Lombardi, David J. West | 2012-11-06 |
| 8227918 | Robust FBEOL and UBM structure of C4 interconnects | Minhua Lu, Eric D. Pefecto, David L. Questad | 2012-07-24 |
| 7806341 | Structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2010-10-05 |
| 7472836 | Method and structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2009-01-06 |
| 7281667 | Method and structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2007-10-16 |
| 6984792 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2006-01-10 |
| 6908025 | Preparing MCM hat for removal | Patrick A. Coico, Steven P. Ostrander | 2005-06-21 |
| 6878608 | Method of manufacture of silicon based package | Peter J. Brofman, Glenn G. Daves, Herbert I. Stoller | 2005-04-12 |
| 6827505 | Optoelectronic package structure and process for planar passive optical and optoelectronic devices | Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, How T. Lin, Steven P. Ostrander +2 more | 2004-12-07 |
| 6784086 | Lead-free solder structure and method for high fatigue life | Amit K. Sarkhel | 2004-08-31 |
| 6762119 | Method of preventing solder wetting in an optical device using diffusion of Cr | Mitchell S. Cohen, Lester W. Herron, Mario J. Interrante, Thomas E. Lombardi, Subhash L. Shinde | 2004-07-13 |
| 6713686 | Apparatus and method for repairing electronic packages | Wiren D. Becker, Dinesh Gupta, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley | 2004-03-30 |
| 6657313 | Dielectric interposer for chip to substrate soldering | Peter J. Brofman, Shaji Faroon, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2003-12-02 |
| 6574859 | Interconnection process for module assembly and rework | Shaji Farooq, Mario J. Interrante, William E. Sablinski | 2003-06-10 |
| 6559527 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2003-05-06 |
| 6548909 | Method of interconnecting electronic components using a plurality of conductive studs | Peter J. Brofman, Kathleen A. Stalter | 2003-04-15 |
| 6502999 | Opto-electronic transceiver module and hermetically sealed housing therefore | Mitchell S. Cohen, David Peter Gaio, William K. Hogan, Steven P. Ostrander, Jeannine M. Trewhella | 2003-01-07 |
| 6429388 | High density column grid array connections and method thereof | Mario J. Interrante, Brenda Peterson, William E. Sablinski, Amit K. Sarkhel | 2002-08-06 |
| 6395991 | Column grid array substrate attachment with heat sink stress relief | Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Gordon J. Robbins | 2002-05-28 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Kathleen A. Stalter | 2002-03-26 |
| 6350625 | Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof | Mitchell S. Cohen, William K. Hogan, James L. Speidell, S. Jay Chey, Steven A. Cordes | 2002-02-26 |
| 6335210 | Baseplate for chip burn-in and/of testing, and method thereof | Mukta S. Farooq, Raymond A. Jackson, Sarah H. Knickerbocker | 2002-01-01 |