Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq +3 more | 2001-12-25 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2001-09-04 |
| 6270363 | Z-axis compressible polymer with fine metal matrix suspension | Peter J. Brofman, John U. Knickerbocker, Kathleen A. Stalter | 2001-08-07 |
| 6258625 | Method of interconnecting electronic components using a plurality of conductive studs | Peter J. Brofman, Kathleen A. Stalter | 2001-07-10 |
| 6259155 | Polymer enhanced column grid array | Mario J. Interrante, Raymond A. Jackson, Paul A. Zucco, Scott R. Dwyer | 2001-07-10 |
| 6235996 | Interconnection structure and process module assembly and rework | Shaji Farooq, Mario J. Interrante, William E. Sablinski | 2001-05-22 |
| 6226863 | Reworkability method for wirebond chips using high performance capacitor | Mukta S. Farooq, Raymond A. Jackson | 2001-05-08 |
| 6220499 | Method for assembling a chip carrier to a semiconductor device | Peter J. Brofman, Shaji Faroog, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2001-04-24 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Kathleen A. Stalter | 2001-04-17 |
| 6184062 | Process for forming cone shaped solder for chip interconnection | Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Scott I. Langenthal, Kathleen A. Stalter | 2001-02-06 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2000-12-12 |
| 6053394 | Column grid array substrate attachment with heat sink stress relief | Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Gordon J. Robbins | 2000-04-25 |
| 6015955 | Reworkability solution for wirebound chips using high performance capacitor | Mukta S. Farooq, Raymond A. Jackson | 2000-01-18 |
| 5961032 | Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold | James H. Covell, Shaji Farooq, Peter A. Gruber | 1999-10-05 |
| 5796169 | Structurally reinforced ball grid array semiconductor package and systems | Robert Charles Dockerty, Ronald Maurice Fraga, Ciro Neal Ramirez, Charles L. Reynolds, Gordon J. Robbins | 1998-08-18 |
| 5543584 | Structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more | 1996-08-06 |
| 5436412 | Interconnect structure having improved metallization | Umar M. Ahmad, Ananda H. Kumar, Eric D. Perfecto, Chandrika Prasad, Sampath Purushothaman | 1995-07-25 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1993-10-12 |
| 5243140 | Direct distribution repair and engineering change system | Harsaran S. Bhatia, Mario J. Interrante, Suresh D. Kadakia, Shashi D. Malaviya, Mark H. McLeod +1 more | 1993-09-07 |
| 5209817 | Selective plating method for forming integral via and wiring layers | Umar M. Ahmad, Daniel G. Berger, Ananda H. Kumar, Susan J. LaMaire, Keshav Prasad +1 more | 1993-05-11 |
| 5153408 | Method and structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more | 1992-10-06 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman +8 more | 1992-07-14 |
| 4985310 | Multilayered metallurgical structure for an electronic component | Birendra Agarwala, Keith F. Beckman, Alice H. Cooper-Joselow, Chandrasekhar Narayan, Sampath Purushothaman | 1991-01-15 |
| 4576659 | Process for inhibiting metal migration during heat cycling of multilayer thin metal film structures | Robert K. Lewis | 1986-03-18 |
| 4489364 | Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface | Dudley A. Chance, Alan Platt, Chung W. Ho | 1984-12-18 |