| 5992729 |
Tacking processes and systems for soldering |
Sundeep Nand Nangalia |
1999-11-30 |
| 5499754 |
Fluxless soldering sample pretreating system |
Stephen M. Bobbio, Sundeep Nand Nangalia |
1996-03-19 |
| 5447264 |
Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
Glenn Rinne, Iwona Turlik |
1995-09-05 |
| 5412537 |
Electrical connector including variably spaced connector contacts |
Paul A. Magill, Glenn Rinne |
1995-05-02 |
| 5407121 |
Fluxless soldering of copper |
Sundeep Nand Nangalia |
1995-04-18 |
| 5381946 |
Method of forming differing volume solder bumps |
Glenn Rinne, Iwona Turlik, Edward K. Yung |
1995-01-17 |
| 5374893 |
Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
Glenn Rinne, Iwona Turlik, Edward K. Yung |
1994-12-20 |
| 5315485 |
Variable size capture pads for multilayer ceramic substrates and connectors therefor |
Paul A. Magill, Glenn Rinne |
1994-05-24 |
| 5289631 |
Method for testing, burn-in, and/or programming of integrated circuit chips |
Glenn Rinne, Iwona Turlik, Edward K. Yung |
1994-03-01 |
| 5251806 |
Method of forming dual height solder interconnections |
Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Li-Chung Lee +8 more |
1993-10-12 |
| 5225711 |
Palladium enhanced soldering and bonding of semiconductor device contacts |
Chin-An Chang, Judith Marie Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh |
1993-07-06 |
| 5130779 |
Solder mass having conductive encapsulating arrangement |
Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Mark F. Chadurjian, Li-Chung Lee +8 more |
1992-07-14 |
| 5048744 |
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts |
Chin-An Chang, Judith Marie Roldan, Steven Strickman, Kamalesh K. Srivastava, Helen L. Yeh |
1991-09-17 |
| 4492842 |
Process of brazing using low temperature braze alloy of gold-indium tin |
Vincent C. Marcotte |
1985-01-08 |
| 4463059 |
Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding |
Somnath Bhattacharya, Dudley A. Chance, Sudipta K. Ray |
1984-07-31 |
| 4434434 |
Solder mound formation on substrates |
Somnath Bhattacharya, Shih-Ming Hu, Chester C. Oldakowski |
1984-02-28 |
| 4332343 |
Process for in-situ modification of solder comopsition |
Vincent C. Marcotte, Stephen Teed |
1982-06-01 |
