Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Nicholas G. Koopman, Li-Chung Lee +8 more | 1993-10-12 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Arthur Bross, Nicholas G. Koopman, Li-Chung Lee +8 more | 1992-07-14 |