Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5517751 | Multilayer microelectronic wiring module and method for forming the same | Robert O. Lussow, Thomas J. Walsh | 1996-05-21 |
| 5410807 | High density electronic connector and method of assembly | Thomas J. Walsh | 1995-05-02 |
| 5401911 | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same | Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1995-03-28 |
| 5399305 | Dynamic gating of polymers for isotropic properties | Thomas J. Walsh | 1995-03-21 |
| 5362360 | Method and product for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces | Thomas J. Walsh | 1994-11-08 |
| 5338208 | High density electronic connector and method of assembly | Thomas J. Walsh | 1994-08-16 |
| 5326245 | Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process | Thomas J. Walsh | 1994-07-05 |
| 5324205 | Array of pinless connectors and a carrier therefor | Umar M. Ahmad, George Czornyj, Harry K. Harrison, Richard Ralph Jones | 1994-06-28 |
| 5312238 | Apparatus for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces | Thomas J. Walsh | 1994-05-17 |
| 5305523 | Method of direct transferring of electrically conductive elements into a substrate | Julian G. Cempa, Robert O. Lussow, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more | 1994-04-26 |
| 5303862 | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures | James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr., Donald E. Myers +3 more | 1994-04-19 |
| 5276964 | Method of manufacturing a high density connector system | Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1994-01-11 |
| 5259110 | Method for forming a multilayer microelectronic wiring module | Robert O. Lussow, Thomas J. Walsh | 1993-11-09 |
| 5251806 | Method of forming dual height solder interconnections | Birendra Agarwala, Aziz Mohammad Ahsan, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee +8 more | 1993-10-12 |
| 5244378 | Apparatus for dynamic gating of polymers for producing molded articles with isotropic properties | Thomas J. Walsh | 1993-09-14 |
| 5225777 | High density probe | Thomas J. Walsh | 1993-07-06 |
| 5205738 | High density connector system | Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1993-04-27 |
| 5130779 | Solder mass having conductive encapsulating arrangement | Birendra Agarwala, Aziz Mohammad Ahsan, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee +8 more | 1992-07-14 |