| 5517751 |
Multilayer microelectronic wiring module and method for forming the same |
Robert O. Lussow, Thomas J. Walsh |
1996-05-21 |
| 5410807 |
High density electronic connector and method of assembly |
Thomas J. Walsh |
1995-05-02 |
| 5401911 |
Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh |
1995-03-28 |
| 5399305 |
Dynamic gating of polymers for isotropic properties |
Thomas J. Walsh |
1995-03-21 |
| 5362360 |
Method and product for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces |
Thomas J. Walsh |
1994-11-08 |
| 5338208 |
High density electronic connector and method of assembly |
Thomas J. Walsh |
1994-08-16 |
| 5326245 |
Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process |
Thomas J. Walsh |
1994-07-05 |
| 5324205 |
Array of pinless connectors and a carrier therefor |
Umar M. Ahmad, George Czornyj, Harry K. Harrison, Richard Ralph Jones |
1994-06-28 |
| 5312238 |
Apparatus for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces |
Thomas J. Walsh |
1994-05-17 |
| 5305523 |
Method of direct transferring of electrically conductive elements into a substrate |
Julian G. Cempa, Robert O. Lussow, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more |
1994-04-26 |
| 5303862 |
Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures |
James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr., Donald E. Myers +3 more |
1994-04-19 |
| 5276964 |
Method of manufacturing a high density connector system |
Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh |
1994-01-11 |
| 5259110 |
Method for forming a multilayer microelectronic wiring module |
Robert O. Lussow, Thomas J. Walsh |
1993-11-09 |
| 5251806 |
Method of forming dual height solder interconnections |
Birendra Agarwala, Aziz Mohammad Ahsan, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee +8 more |
1993-10-12 |
| 5244378 |
Apparatus for dynamic gating of polymers for producing molded articles with isotropic properties |
Thomas J. Walsh |
1993-09-14 |
| 5225777 |
High density probe |
Thomas J. Walsh |
1993-07-06 |
| 5205738 |
High density connector system |
Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh |
1993-04-27 |
| 5130779 |
Solder mass having conductive encapsulating arrangement |
Birendra Agarwala, Aziz Mohammad Ahsan, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee +8 more |
1992-07-14 |
