Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5401911 | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same | Herbert R. Anderson, Jr., Arthur Bross, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1995-03-28 |
| 5305523 | Method of direct transferring of electrically conductive elements into a substrate | Arthur Bross, Robert O. Lussow, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more | 1994-04-26 |
| 5276964 | Method of manufacturing a high density connector system | Herbert R. Anderson, Jr., Arthur Bross, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1994-01-11 |
| 5205738 | High density connector system | Herbert R. Anderson, Jr., Arthur Bross, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1993-04-27 |