| 5517751 |
Multilayer microelectronic wiring module and method for forming the same |
Arthur Bross, Thomas J. Walsh |
1996-05-21 |
| 5401911 |
Via and pad structure for thermoplastic substrates and method and apparatus for forming the same |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh |
1995-03-28 |
| 5397604 |
Non-contact fluid applicator apparatus and method |
Robert Phillips, III, Norman J. Dauerer, Peter Elenius, Brian M. Kerrigan, Helmut H. A. Krueger |
1995-03-14 |
| 5305523 |
Method of direct transferring of electrically conductive elements into a substrate |
Arthur Bross, Julian G. Cempa, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more |
1994-04-26 |
| 5303862 |
Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures |
Arthur Bross, James J. Hedrick, Robert D. Johnson, James R. Lyerla, Jr., Donald E. Myers +3 more |
1994-04-19 |
| 5276964 |
Method of manufacturing a high density connector system |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh |
1994-01-11 |
| 5259110 |
Method for forming a multilayer microelectronic wiring module |
Arthur Bross, Thomas J. Walsh |
1993-11-09 |
| 5205738 |
High density connector system |
Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh |
1993-04-27 |
| 4879156 |
Multilayered ceramic substrate having solid non-porous metal conductors |
Lester W. Herron, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy |
1989-11-07 |
| 4753694 |
Process for forming multilayered ceramic substrate having solid metal conductors |
Lester W. Herron, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy |
1988-06-28 |
| 4649417 |
Multiple voltage integrated circuit packaging substrate |
Allan C. Burgess, George E. Melvin |
1987-03-10 |
