Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5517751 | Multilayer microelectronic wiring module and method for forming the same | Arthur Bross, Thomas J. Walsh | 1996-05-21 |
| 5401911 | Via and pad structure for thermoplastic substrates and method and apparatus for forming the same | Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh | 1995-03-28 |
| 5397604 | Non-contact fluid applicator apparatus and method | Robert Phillips, III, Norman J. Dauerer, Peter Elenius, Brian M. Kerrigan, Helmut H. A. Krueger | 1995-03-14 |
| 5305523 | Method of direct transferring of electrically conductive elements into a substrate | Arthur Bross, Julian G. Cempa, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more | 1994-04-26 |
| 5303862 | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures | Arthur Bross, James J. Hedrick, Robert D. Johnson, James R. Lyerla, Jr., Donald E. Myers +3 more | 1994-04-19 |
| 5276964 | Method of manufacturing a high density connector system | Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh | 1994-01-11 |
| 5259110 | Method for forming a multilayer microelectronic wiring module | Arthur Bross, Thomas J. Walsh | 1993-11-09 |
| 5205738 | High density connector system | Herbert R. Anderson, Jr., Arthur Bross, Julian G. Cempa, Donald E. Myers, Thomas J. Walsh | 1993-04-27 |
| 4879156 | Multilayered ceramic substrate having solid non-porous metal conductors | Lester W. Herron, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy | 1989-11-07 |
| 4753694 | Process for forming multilayered ceramic substrate having solid metal conductors | Lester W. Herron, Robert W. Nufer, Bernard Schwartz, John Acocella, Srinivasa N. Reddy | 1988-06-28 |
| 4649417 | Multiple voltage integrated circuit packaging substrate | Allan C. Burgess, George E. Melvin | 1987-03-10 |