Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8268716 | Creation of lead-free solder joint with intermetallics | Charles L. Arvin, Valerie Oberson, Krystyna W. Semkow, Richard A. Shelleman, Kamalesh K. Srivistava | 2012-09-18 |
| 6987316 | Multilayer ceramic substrate with single via anchored pad and method of forming | Mukta G. Farooq, Kevin M. Prettyman | 2006-01-17 |
| 6461493 | Decoupling capacitor method and structure using metal based carrier | Mukta S. Farooq, Shaji Farooq, John U. Knickerbocker, Robert A. Rita | 2002-10-08 |
| 6131796 | Direct brazing of refractory metal features | Suryanarayana Kaja, Donald R. Wall | 2000-10-17 |
| 5483105 | Module input-output pad having stepped set-back | Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Vivek M. Sura +1 more | 1996-01-09 |
| 5130067 | Method and means for co-sintering ceramic/metal MLC substrates | Philip L. Flaitz, Arlyne M. Flanagan, Joseph M. Harvilchuck, Lester W. Herron, John U. Knickerbocker +3 more | 1992-07-14 |
| 4879156 | Multilayered ceramic substrate having solid non-porous metal conductors | Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, John Acocella | 1989-11-07 |
| 4753694 | Process for forming multilayered ceramic substrate having solid metal conductors | Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, John Acocella | 1988-06-28 |