Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6504105 | Solder ball connections and assembly process | Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more | 2003-01-07 |
| 5675889 | Solder ball connections and assembly process | Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr., Karl G. Hoebener +1 more | 1997-10-14 |
| 5591941 | Solder ball interconnected assembly | Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more | 1997-01-07 |
| 5338900 | Structures for electrically conductive decals filled with inorganic insulator material | Mark S. Schneider, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz | 1994-08-16 |
| 5294830 | Apparatus for indirect impingement cooling of integrated circuit chips | Steven P. Young, Albert Joseph Fahey, Gaetano P. Messina, Seaho Song | 1994-03-15 |
| 5277725 | Process for fabricating a low dielectric composite substrate | Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more | 1994-01-11 |
| 5167913 | Method of forming an adherent layer of metallurgy on a ceramic substrate | Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker, Paul H. Palmateer +2 more | 1992-12-01 |
| 5139851 | Low dielectric composite substrate | Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke, Renuka S. Divakaruni +10 more | 1992-08-18 |
| 5135595 | Process for fabricating a low dielectric composite substrate | Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more | 1992-08-04 |
| 5108541 | Processes for electrically conductive decals filled with inorganic insulator material | Mark S. Schneider, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz | 1992-04-28 |
| 5031029 | Copper device and use thereof with semiconductor devices | Nanik Bakhru, Alfred Grill, Egidio Marotta, Bernard S. Meyerson, Vishnubhai V. Patel | 1991-07-09 |
| 4879156 | Multilayered ceramic substrate having solid non-porous metal conductors | Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, Srinivasa N. Reddy | 1989-11-07 |
| 4753694 | Process for forming multilayered ceramic substrate having solid metal conductors | Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, Srinivasa N. Reddy | 1988-06-28 |
| 4747907 | Metal etching process with etch rate enhancement | Lawrence D. David | 1988-05-31 |
| 4620863 | Radiation coloration resistant glass | Minoru Tomozawa, E. Watson | 1986-11-04 |