| 6504105 |
Solder ball connections and assembly process |
Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more |
2003-01-07 |
$16,905,000 |
| 5675889 |
Solder ball connections and assembly process |
Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr., Karl G. Hoebener +1 more |
1997-10-14 |
$31,107,000 |
| 5591941 |
Solder ball interconnected assembly |
Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more |
1997-01-07 |
$25,755,000 |
| 5338900 |
Structures for electrically conductive decals filled with inorganic insulator material |
Mark S. Schneider, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz |
1994-08-16 |
$10,305,000 |
| 5294830 |
Apparatus for indirect impingement cooling of integrated circuit chips |
Steven P. Young, Albert Joseph Fahey, Gaetano P. Messina, Seaho Song |
1994-03-15 |
$8,476,000 |
| 5277725 |
Process for fabricating a low dielectric composite substrate |
Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more |
1994-01-11 |
$8,526,000 |
| 5167913 |
Method of forming an adherent layer of metallurgy on a ceramic substrate |
Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker, Paul H. Palmateer +2 more |
1992-12-01 |
$10,188,000 |
| 5139851 |
Low dielectric composite substrate |
Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke, Renuka S. Divakaruni +10 more |
1992-08-18 |
$15,391,000 |
| 5135595 |
Process for fabricating a low dielectric composite substrate |
Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey +21 more |
1992-08-04 |
$10,228,000 |
| 5108541 |
Processes for electrically conductive decals filled with inorganic insulator material |
Mark S. Schneider, Lester W. Herron, Mark R. Kordus, Louis H. Wirtz |
1992-04-28 |
$11,441,000 |
| 5031029 |
Copper device and use thereof with semiconductor devices |
Nanik Bakhru, Alfred Grill, Egidio Marotta, Bernard S. Meyerson, Vishnubhai V. Patel |
1991-07-09 |
$11,976,000 |
| 4879156 |
Multilayered ceramic substrate having solid non-porous metal conductors |
Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, Srinivasa N. Reddy |
1989-11-07 |
$17,734,000 |
| 4753694 |
Process for forming multilayered ceramic substrate having solid metal conductors |
Lester W. Herron, Robert O. Lussow, Robert W. Nufer, Bernard Schwartz, Srinivasa N. Reddy |
1988-06-28 |
$46,253,000 |
| 4747907 |
Metal etching process with etch rate enhancement |
Lawrence D. David |
1988-05-31 |
$31,733,000 |
| 4620863 |
Radiation coloration resistant glass |
Minoru Tomozawa, E. Watson |
1986-11-04 |
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