| 6504105 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, David P. Watson +1 more |
2003-01-07 |
| 5825629 |
Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment |
Eric M. Hubacher, Julian Partridge |
1998-10-20 |
| 5762259 |
Method for forming bumps on a substrate |
Eric M. Hubacher |
1998-06-09 |
| 5758413 |
Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias |
Ku Ho Chong, Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Michael G. McMaster |
1998-06-02 |
| 5699613 |
Fine dimension stacked vias for a multiple layer circuit board structure |
Ku Ho Chong, Charles H. Crockett, Jr., Stephen Alan Dunn, deceased, Michael G. McMaster |
1997-12-23 |
| 5675889 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr. +1 more |
1997-10-14 |
| 5591941 |
Solder ball interconnected assembly |
John Acocella, Donald R. Banks, Joseph A. Benenati, Thomas Caulfield, David P. Watson +1 more |
1997-01-07 |
| 5492266 |
Fine pitch solder deposits on printed circuit board process and product |
Eric M. Hubacher, Julian Partridge |
1996-02-20 |
| 5147084 |
Interconnection structure and test method |
John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Bruno T. Klingel +1 more |
1992-09-15 |
| 5060844 |
Interconnection structure and test method |
John R. Behun, Anson J. Call, Francis F. Cappo, Marie Cole, Bruno T. Klingel +1 more |
1991-10-29 |
| 4998342 |
Method of attaching electronic components |
Ralph E. Bonnell, George C. Castello |
1991-03-12 |
| 4919970 |
Solder deposition control |
John Stankus |
1990-04-24 |
| 4761881 |
Single step solder process |
Muhammad-Yusuf J. Bora |
1988-08-09 |
