Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6504105 | Solder ball connections and assembly process | John Acocella, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more | 2003-01-07 |
| 6015722 | Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate | Ronald G. Pofahl, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 2000-01-18 |
| 5970319 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Ronald G. Pofahl, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 1999-10-19 |
| 5919329 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Ronald G. Pofahl, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 1999-07-06 |
| 5910354 | Metallurgical interconnect composite | Carmine G. Meola, Daniel D. Johnson, Joseph G. Ameen | 1999-06-08 |
| 5675889 | Solder ball connections and assembly process | John Acocella, Joseph A. Benenati, Thomas Caulfield, John Saunders Corbin, Jr., Karl G. Hoebener +1 more | 1997-10-14 |
| 5591941 | Solder ball interconnected assembly | John Acocella, Joseph A. Benenati, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more | 1997-01-07 |