DJ

Daniel D. Johnson

EA E.I. Du Pont De Nemours And: 5 patents #1,460 of 8,010Top 20%
OM Omnia Medical: 5 patents #1 of 4Top 25%
WG W.L. Gore & Associates Gmbh: 5 patents #185 of 1,175Top 20%
University of Michigan: 1 patents #1,906 of 4,352Top 45%
📍 Ann Arbor, MI: #416 of 6,071 inventorsTop 7%
🗺 Michigan: #4,032 of 86,293 inventorsTop 5%
Overall (All Time): #215,531 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
12319542 Dynamic tractive drive for vertical transportation system James Hutchinson 2025-06-03
11819418 Multi-material multi-component spinal implant Troy Schifano 2023-11-21
11766339 Multi-material multi-component spinal implant Troy Schifano 2023-09-26
10918497 Multi-material multi-component spinal implant Troy Schifano, Stephen T. Anderson, Peter Materna 2021-02-16
10895250 Solar powered emergency water pump system 2021-01-19
10751196 Multi-material multi-component spinal implant Troy Schifano, Stephen T. Anderson 2020-08-25
10736752 Multi-material multi-component spinal implant Troy Schifano, Stephen T. Anderson, Peter Materna 2020-08-11
8845566 Active exoskeletal spinal orthosis and method of orthotic treatment James A. Ashton-Miller, Albert Shih 2014-09-30
D429624 Concrete curb form device 2000-08-22
5910354 Metallurgical interconnect composite Carmine G. Meola, Donald R. Banks, Joseph G. Ameen 1999-06-08
5761053 Faraday cage David R. King, Joseph C. Rowan, Bradley E. Reis 1998-06-02
5431571 Electrical conductive polymer matrix James R. Hanrahan 1995-07-11
4769269 Article containing conductive through-holes Herbert L. Fritz 1988-09-06
4747897 Dielectric materials 1988-05-31
4744499 System for automated manufacture of pressure vessels Robert L. Johnson 1988-05-17
4680220 Dielectric materials 1987-07-14
4517050 Process for forming conductive through-holes through a dielectric layer Herbert L. Fritz 1985-05-14
4501638 Liquid chemical process for forming conductive through-holes through a dielectric layer 1985-02-26
4472238 Process using plasma for forming conductive through-holes through a dielectric layer 1984-09-18
4378264 Integrated laminating process Yvan P. Pilette 1983-03-29