Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6015722 | Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate | Donald R. Banks, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 2000-01-18 |
| 5970319 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Donald R. Banks, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 1999-10-19 |
| 5919329 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Donald R. Banks, Mark F. Sylvester, William George Petefish, Paul J. Fischer | 1999-07-06 |