Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7593933 | Method and apparatus for a collaborative interaction network | Kymberlee Weil, Beau Ambur | 2009-09-22 |
| 6847527 | Interconnect module with reduced power distribution impedance | David A. Hanson, William George Petefish | 2005-01-25 |
| 6344371 | Dimensionally stable core for use in high density chip packages and a method of fabricating same | Paul J. Fischer, Robin E. Gorrell | 2002-02-05 |
| 6248959 | Substrate with die area having same CTE as IC | — | 2001-06-19 |
| 6183592 | Method for minimizing warp in the production of electronic assemblies | — | 2001-02-06 |
| 6184589 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, David B. Noddin, William George Petefish | 2001-02-06 |
| 6127250 | Method of increasing package reliability by designing in plane CTE gradients | David B. Noddin | 2000-10-03 |
| 6027590 | Method for minimizing warp and die stress in the production of an electronic assembly | William George Petefish, Paul J. Fischer | 2000-02-22 |
| 6015722 | Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate | Donald R. Banks, Ronald G. Pofahl, William George Petefish, Paul J. Fischer | 2000-01-18 |
| 6014317 | Chip package mounting structure for controlling warp of electronic assemblies due to thermal expansion effects | — | 2000-01-11 |
| 6011697 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, David B. Noddin, William George Petefish | 2000-01-04 |
| 5983974 | Method of making a lid for a chip/package system | — | 1999-11-16 |
| 5970319 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Donald R. Banks, Ronald G. Pofahl, William George Petefish, Paul J. Fischer | 1999-10-19 |
| 5919329 | Method for assembling an integrated circuit chip package having at least one semiconductor device | Donald R. Banks, Ronald G. Pofahl, William George Petefish, Paul J. Fischer | 1999-07-06 |
| 5900312 | Integrated circuit chip package assembly | — | 1999-05-04 |
| 5888630 | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly | David B. Noddin | 1999-03-30 |
| 5888631 | Method for minimizing warp in the production of electronic assemblies | — | 1999-03-30 |
| 5879786 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, David B. Noddin, William George Petefish | 1999-03-09 |
| 5868887 | Method for minimizing warp and die stress in the production of an electronic assembly | William George Petefish, Paul J. Fischer | 1999-02-09 |
| 5847327 | Dimensionally stable core for use in high density chip packages | Paul J. Fischer, Robin E. Gorrell | 1998-12-08 |
| 5838063 | Method of increasing package reliability using package lids with plane CTE gradients | — | 1998-11-17 |
| 5778523 | Method for controlling warp of electronic assemblies by use of package stiffener | — | 1998-07-14 |
| 5287619 | Method of manufacture multichip module substrate | W. David Smith, John Albert Olenick, Carlos L. Barton, Jane L. Cercena, Daniel J. Navarro +12 more | 1994-02-22 |