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Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
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2018-03-13 |
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Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof |
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2014-08-19 |
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Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
David H. Guo |
2010-05-25 |
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Circuits, multi-layer circuits, and methods of manufacture thereof |
Murali Sethumadhavan, Scott D. Kennedy |
2007-02-20 |
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Polymeric organic coatings and method of manufacture thereof |
Thomas A. P. Seery, Hanrong Gao, Jayanthi Jacob |
2003-04-29 |
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Method for metallizing fluoropolymer substrates |
Robert B. McGraw |
1995-05-09 |
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Method of manufacture multichip module substrate |
W. David Smith, John Albert Olenick, Jane L. Cercena, Daniel J. Navarro, Kathleen Ritter Olenick +12 more |
1994-02-22 |
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Method of laser drilling fluoropolymer materials |
Richard T. Traskos, Cathy Fleischer, David B. Noddin |
1990-04-10 |
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Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom |
Adrienne Lindsay, Samuel W. Henson |
1989-03-14 |
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Epoxy foam |
Scott S. Simpson, Anthony Yeznach |
1985-10-08 |