Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6203891 | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | — | 2001-03-20 |
| 6184589 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, Mark F. Sylvester, William George Petefish | 2001-02-06 |
| 6132853 | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | — | 2000-10-17 |
| 6130015 | Method for using fiducial schemes to increase nominal registration during manufacture of laminated circuit | Donald G. Hutchins | 2000-10-10 |
| 6127250 | Method of increasing package reliability by designing in plane CTE gradients | Mark F. Sylvester | 2000-10-03 |
| 6103992 | Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias | — | 2000-08-15 |
| 6023041 | Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance | — | 2000-02-08 |
| 6018196 | Semiconductor flip chip package | — | 2000-01-25 |
| 6011697 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, Mark F. Sylvester, William George Petefish | 2000-01-04 |
| 5973290 | Laser apparatus having improved via processing rate | — | 1999-10-26 |
| 5965043 | Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias | Robin E. Gorrell, Michael R. Leaf | 1999-10-12 |
| 5910255 | Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation | — | 1999-06-08 |
| 5888630 | Apparatus and method for unit area composition control to minimize warp in an integrated circuit chip package assembly | Mark F. Sylvester | 1999-03-30 |
| 5879786 | Constraining ring for use in electronic packaging | John J. Budnaitis, Paul J. Fischer, David A. Hanson, Mark F. Sylvester, William George Petefish | 1999-03-09 |
| 5868950 | Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques | — | 1999-02-09 |
| 5841102 | Multiple pulse space processing to enhance via entrance formation at 355 nm | — | 1998-11-24 |
| 5731047 | Multiple frequency processing to improve electrical resistivity of blind micro-vias | — | 1998-03-24 |
| 5276955 | Multilayer interconnect system for an area array interconnection using solid state diffusion | Robin E. Gorrell, William George Petefish, Kevin L. Stumpe, Boydd Piper, Deepak Swamy +2 more | 1994-01-11 |
| 5046238 | Method of manufacturing a multilayer circuit board | Robert C. Daigle, Samuel Malbaurn | 1991-09-10 |
| 4915981 | Method of laser drilling fluoropolymer materials | Richard T. Traskos, Cathy Fleischer, Carlos L. Barton | 1990-04-10 |