Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381107 | Protective tapes, articles therefrom, and methods of making and using same | Shujun Wang, Roger A. Grisle, Richard Y. Liu, Yaoyao Chen | 2025-08-05 |
| 11324113 | Electrical conductors | Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more | 2022-05-03 |
| 11164063 | Multilayer stack including RFID tag | John D. Geissinger, Donald G. Peterson, Howard M. Kaplan | 2021-11-02 |
| 10740669 | Film assembly and multilayer stack including antenna | John D. Geissinger, Donald G. Peterson, Howard M. Kaplan | 2020-08-11 |
| 10653006 | Electrical conductors | Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more | 2020-05-12 |
| 10628727 | RFID tag on stretchable substrate | John D. Geissinger, Howard M. Kaplan | 2020-04-21 |
| 10496915 | RFID tag on flexible substrate | John D. Geissinger, Donald G. Peterson, Howard M. Kaplan | 2019-12-03 |
| 10229353 | RFID tag on stretchable substrate | John D. Geissinger, Howard M. Kaplan | 2019-03-12 |
| 6344371 | Dimensionally stable core for use in high density chip packages and a method of fabricating same | Paul J. Fischer, Mark F. Sylvester | 2002-02-05 |
| 5976974 | Method of forming redundant signal traces and corresponding electronic components | Paul J. Fischer | 1999-11-02 |
| 5965043 | Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias | David B. Noddin, Michael R. Leaf | 1999-10-12 |
| 5847327 | Dimensionally stable core for use in high density chip packages | Paul J. Fischer, Mark F. Sylvester | 1998-12-08 |
| 5786270 | Method of forming raised metallic contacts on electrical circuits for permanent bonding | Paul J. Fischer | 1998-07-28 |
| 5747358 | Method of forming raised metallic contacts on electrical circuits | Paul J. Fischer | 1998-05-05 |
| 5276955 | Multilayer interconnect system for an area array interconnection using solid state diffusion | David B. Noddin, William George Petefish, Kevin L. Stumpe, Boydd Piper, Deepak Swamy +2 more | 1994-01-11 |