Robin E. Gorrell — 15 Patents at 3M

Robin E. Gorrell has been granted 15 US patents while listed as an inventor at 3M. The first was granted in 1994 and the most recent in August 2025. Robin E. Gorrell ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Robin E. Gorrell in Round Rock, TX, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12381107	Protective tapes, articles therefrom, and methods of making and using same	Shujun Wang, Roger A. Grisle, Richard Y. Liu, Yaoyao Chen	2025-08-05
11324113	Electrical conductors	Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more	2022-05-03	$39,087,000
11164063	Multilayer stack including RFID tag	John D. Geissinger, Donald G. Peterson, Howard M. Kaplan	2021-11-02	$54,104,000
10740669	Film assembly and multilayer stack including antenna	John D. Geissinger, Donald G. Peterson, Howard M. Kaplan	2020-08-11	$44,779,000
10653006	Electrical conductors	Nicholas T. Gabriel, Ronald D. Jesme, Andrew J. Ouderkirk, Ravi Palaniswamy, Andrew P. Bonifas +2 more	2020-05-12	$40,265,000
10628727	RFID tag on stretchable substrate	John D. Geissinger, Howard M. Kaplan	2020-04-21	$35,653,000
10496915	RFID tag on flexible substrate	John D. Geissinger, Donald G. Peterson, Howard M. Kaplan	2019-12-03	$30,904,000
10229353	RFID tag on stretchable substrate	John D. Geissinger, Howard M. Kaplan	2019-03-12	$38,105,000
6344371	Dimensionally stable core for use in high density chip packages and a method of fabricating same	Paul J. Fischer, Mark F. Sylvester	2002-02-05
5976974	Method of forming redundant signal traces and corresponding electronic components	Paul J. Fischer	1999-11-02
5965043	Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias	David B. Noddin, Michael R. Leaf	1999-10-12
5847327	Dimensionally stable core for use in high density chip packages	Paul J. Fischer, Mark F. Sylvester	1998-12-08
5786270	Method of forming raised metallic contacts on electrical circuits for permanent bonding	Paul J. Fischer	1998-07-28
5747358	Method of forming raised metallic contacts on electrical circuits	Paul J. Fischer	1998-05-05
5276955	Multilayer interconnect system for an area array interconnection using solid state diffusion	David B. Noddin, William George Petefish, Kevin L. Stumpe, Boydd Piper, Deepak Swamy +2 more	1994-01-11

Robin E. Gorrell — 15 Patents

Issued Patents All Time

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