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Manufacturing line, process, and sintered article |
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Manufacturing line, process, and sintered article |
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Manufacturing line, process, and sintered article |
Michael Edward Badding, William Joseph Bouton, Jacqueline Leslie Brown, Timothy Joseph Curry, Roman E Hurny +8 more |
2024-04-09 |
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Method of manufacturing ceramic tape |
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2023-09-26 |
| 11629915 |
Method of manufacturing ceramic tape |
Michael Edward Badding, William Joseph Bouton, Jacqueline Leslie Brown, Timothy Joseph Curry, Roman E Hurny +8 more |
2023-04-18 |
| 11148321 |
Polycrystalline waveguide |
Michael Edward Badding, William Joseph Bouton, Jacqueline Leslie Brown, Timothy Joseph Curry, Roman E Hurny +8 more |
2021-10-19 |
| 10967539 |
Manufacturing line, process, and sintered article |
Michael Edward Badding, William Joseph Bouton, Jacqueline Leslie Brown, Timothy Joseph Curry, Roman E Hurny +8 more |
2021-04-06 |
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Manufacturing line, process, and sintered article |
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2020-12-29 |
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Manufacturing line, process, and sintered article |
Michael Edward Badding, William Joseph Bouton, Jacqueline Leslie Brown, Timothy Joseph Curry, Roman E Hurny +8 more |
2020-09-08 |
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Flexible kesterite photovoltaic device on ceramic substrate |
Teodor K. Todorov |
2020-03-03 |
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Flexible kesterite photovoltaic device on ceramic substrate |
Teodor K. Todorov |
2018-03-13 |
| 7281412 |
In-situ seal integrity monitoring |
Timothy Joseph Curry, Robert A. Bourdelaise, Eli A. Richards, Paul A. Vichot, Barry E. Grabow +1 more |
2007-10-16 |
| 6501643 |
Carrying case for personal digital assistant device and ancillary electronic device |
Barbara A. Sayers |
2002-12-31 |
| 5440805 |
Method of manufacturing a multilayer circuit |
Robert C. Daigle, W. David Smith, David J. Arthur, Gwo S. Swei |
1995-08-15 |
| 5329695 |
Method of manufacturing a multilayer circuit board |
Richard T. Traskos |
1994-07-19 |
| 5287619 |
Method of manufacture multichip module substrate |
W. David Smith, Carlos L. Barton, Jane L. Cercena, Daniel J. Navarro, Kathleen Ritter Olenick +12 more |
1994-02-22 |
| 5274912 |
Method of manufacturing a multilayer circuit board |
Robert C. Daigle |
1994-01-04 |
| 5041695 |
Co-fired ceramic package for a power circuit |
Allen B. Timberlake |
1991-08-20 |
| 5027191 |
Cavity-down chip carrier with pad grid array |
Robert A. Bourdelaise, David Harris, Denise Harris |
1991-06-25 |
