| 6656770 |
Thermal enhancement approach using solder compositions in the liquid state |
Eugene Atwood, Giulio DiGiacomo, Horatio Quinones |
2003-12-02 |
| 6504105 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more |
2003-01-07 |
| 6358627 |
Rolling ball connector |
Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis, Wayne J. Howell +4 more |
2002-03-19 |
| 6281573 |
Thermal enhancement approach using solder compositions in the liquid state |
Eugene Atwood, Giulio DiGiacomo, Horatio Quinones |
2001-08-28 |
| 6258627 |
Underfill preform interposer for joining chip to substrate |
William T. Chen, Lisa A. Fanti, Wayne J. Howell, John U. Knickerbocker |
2001-07-10 |
| 6212070 |
Zero force heat sink |
Eugene Atwood, James J. Dankelman, Horatio Quinones, Karl J. Puttlitz, Eric J. Kastberg |
2001-04-03 |
| 6177729 |
Rolling ball connector |
Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis, Wayne J. Howell +4 more |
2001-01-23 |
| 5805430 |
Zero force heat sink |
Eugene Atwood, James J. Dankelman, Horatio Quinones, Karl J. Puttlitz, Eric J. Kastberg |
1998-09-08 |
| 5675889 |
Solder ball connections and assembly process |
John Acocella, Donald R. Banks, Thomas Caulfield, John Saunders Corbin, Jr., Karl G. Hoebener +1 more |
1997-10-14 |
| 5591941 |
Solder ball interconnected assembly |
John Acocella, Donald R. Banks, Thomas Caulfield, Karl G. Hoebener, David P. Watson +1 more |
1997-01-07 |
| 5297618 |
Apparatus for removing a heatsink from an electronic module or package |
John R. Behun |
1994-03-29 |
