Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7572726 | Method of forming a bond pad on an I/C chip and resulting structure | Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2009-08-11 |
| 6995475 | I/C chip suitable for wire bonding | Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2006-02-07 |
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, David E. Eichstadt, Stephen Kilpatrick, Henry A. Nye, III +1 more | 2005-05-31 |
| 6622907 | Sacrificial seed layer process for forming C4 solder bumps | Randolph F. Knarr, Erik J. Roggeman, Kamalesh K. Srivastava | 2003-09-23 |
| 6468413 | Electrochemical etch for high tin solder bumps | John M. Cotte, David E. Eichstadt | 2002-10-22 |
| 6258627 | Underfill preform interposer for joining chip to substrate | Joseph A. Benenati, William T. Chen, Wayne J. Howell, John U. Knickerbocker | 2001-07-10 |
| 6130170 | Process improvements for titanium-tungsten etching in the presence of electroplated C4's | Lawrence D. David | 2000-10-10 |
| 6015505 | Process improvements for titanium-tungsten etching in the presence of electroplated C4's | Lawrence D. David | 2000-01-18 |
| 5935402 | Process for stabilizing organic additives in electroplating of copper | — | 1999-08-10 |
| 5908540 | Copper anode assembly for stabilizing organic additives in electroplating of copper | — | 1999-06-01 |
| 5904156 | Dry film resist removal in the presence of electroplated C4's | Gerald G. Advocate, Jr., Henry A. Nye, III | 1999-05-18 |