Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673176 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2017-06-06 |
| 9666563 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2017-05-30 |
| 9653431 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2017-05-16 |
| 9653432 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2017-05-16 |
| 9515051 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2016-12-06 |
| 9017486 | Deposition chamber cleaning method including stressed cleaning layer | Zhengwen Li, Keith Kwong Hon Wong | 2015-04-28 |
| 9017487 | Deposition chamber cleaning method including stressed cleaning layer | Zhengwen Li, Keith Kwong Hon Wong | 2015-04-28 |
| 8916448 | Metal to metal bonding for stacked (3D) integrated circuits | Mukta G. Farooq, John A. Fitzsimmons | 2014-12-23 |
| 8444868 | Method for removing copper oxide layer | Stephan Grunow, Zhengwen Li, Huilong Zhu | 2013-05-21 |
| 8415252 | Selective copper encapsulation layer deposition | Abhishek Dube, Zhengwen Li, Huilong Zhu | 2013-04-09 |
| 8384219 | Semiconductor having interconnects with improved mechanical properties by insertion of nanoparticles | Junjing Bao, Naftali E. Lustig | 2013-02-26 |
| 8373273 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Hyeok-Sang Oh, Woo Jin Jang, Bum Ki Moon, Ji-Hong Choi, Minseok Oh | 2013-02-12 |
| 8232200 | Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed thereby | Hyeok-Sang Oh, Woo Jin Jang, Bum Ki Moon, Ji-Hong Choi, Minseok Oh | 2012-07-31 |
| 8129269 | Method of improving mechanical properties of semiconductor interconnects with nanoparticles | Junjing Bao, Naftali E. Lustig | 2012-03-06 |
| 8105937 | Conformal adhesion promoter liner for metal interconnects | Zhengwen Li, Keith Kwong Hon Wong, Huilong Zhu | 2012-01-31 |
| 8026166 | Interconnect structures comprising capping layers with low dielectric constants and methods of making the same | Griselda Bonilla, Lawrence A. Clevenger, Stephan Grunow, Chao-Kun Hu, Roger A. Quon +5 more | 2011-09-27 |
| 7923836 | BLM structure for application to copper pad | Mukta G. Farooq, Roger A. Quon | 2011-04-12 |
| 7767575 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Sarah H. Knickerbocker, Roger A. Quinn, William E. Sablinski +3 more | 2010-08-03 |
| 7572726 | Method of forming a bond pad on an I/C chip and resulting structure | Julie C. Biggs, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2009-08-11 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2009-07-28 |
| 7473997 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Sarah H. Knickerbocker, Roger A. Quon, William E. Sablinski +3 more | 2009-01-06 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2008-02-19 |
| 7144490 | Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer | David E. Eichstadt, Jonathan H. Griffith, Sarah H. Knickerbocker, Rosemary A. Previti-Kelly, Roger A. Quon +2 more | 2006-12-05 |
| 6995084 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Sarah H. Knickerbocker, Roger A. Quon, William E. Sablinski +3 more | 2006-02-07 |
| 6995475 | I/C chip suitable for wire bonding | Julie C. Biggs, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2006-02-07 |