TC

Tien-Jen Cheng

IBM: 31 patents #3,235 of 70,183Top 5%
Samsung: 3 patents #30,683 of 75,807Top 45%
AM AMD: 1 patents #5,683 of 9,279Top 65%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
EN Engelhard: 1 patents #271 of 518Top 55%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
📍 Bedford, NY: #2 of 77 inventorsTop 3%
🗺 New York: #3,387 of 115,490 inventorsTop 3%
Overall (All Time): #103,421 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 26–34 of 34 patents

Patent #TitleCo-InventorsDate
6992389 Barrier for interconnect and method Panayotis Andricacos, Emanuel I. Cooper, David E. Eichstadt, Jonathan H. Griffith, Randolph F. Knarr +2 more 2006-01-31
6927472 Fuse structure and method to form the same David K. Anderson, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more 2005-08-09
6924185 Fuse structure and method to form the same David K. Anderson, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu, Chandrasekhar Narayan +3 more 2005-08-02
6896784 Method for controlling local current to achieve uniform plating thickness Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong 2005-05-24
6890413 Method and apparatus for controlling local current to achieve uniform plating thickness Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong 2005-05-10
6534863 Common ball-limiting metallurgy for I/O sites George F. Walker, Ronald D. Goldblatt, Peter A. Gruber, Raymond R. Horton, Kevin S. Petrarca +1 more 2003-03-18
6235412 Corrosion-resistant terminal metal pads for thin film packages Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu 2001-05-22
6083375 Process for producing corrosion-resistant terminal metal pads for thin film packages Ajay P. Giri, Ashwani K. Malhotra, John R. Pennacchia, Eric D. Perfecto, Roy Yu 2000-07-04
5728433 Method for gold replenishment of electroless gold bath David B. Shields 1998-03-17