Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851911 | Semiconductor chip used in flip chip process | Charles F. Carey, Bernt Julius Hansen, David L. Questad, Wolfgang Sauter | 2010-12-14 |
| 7674637 | Monitoring cool-down stress in a flip chip process using monitor solder bump structures | Charles F. Carey, Bernt Julius Hansen, David L. Questad, Wolfgang Sauter | 2010-03-09 |
| 6241868 | Method for electroplating a film onto a substrate | Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Suryanarayana Kaja, Phillip W. Palmatier | 2001-06-05 |
| 6235412 | Corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, John R. Pennacchia, Eric D. Perfecto, Roy Yu | 2001-05-22 |
| 6188124 | Semiconductor arrangement preventing damage during contact processing | Gregory S. Boettcher, Robert P. Katz, James Wood | 2001-02-13 |
| 6183588 | Process for transferring a thin-film structure to a substrate | Kimberley A. Kelly, Eric D. Perfecto, Roy Yu | 2001-02-06 |
| 6143117 | Process for transferring a thin-film structure to a temporary carrier | Kimberley A. Kelly, Eric D. Perfecto, Roy Yu | 2000-11-07 |
| 6083375 | Process for producing corrosion-resistant terminal metal pads for thin film packages | Tien-Jen Cheng, Ajay P. Giri, John R. Pennacchia, Eric D. Perfecto, Roy Yu | 2000-07-04 |
| 6077405 | Method and apparatus for making electrical contact to a substrate during electroplating | Glen N. Biggs, Donald M. Brewer, James E. Fluegel, Suryanarayana Kaja, Phillip W. Palmatier | 2000-06-20 |
| 6036809 | Process for releasing a thin-film structure from a substrate | Kimberley A. Kelly, Eric D. Perfecto, Roy Yu | 2000-03-14 |
| 6002267 | In-line voltage plane tests for multi-chip modules | John R. Pennacchia, Ronald R. Shields, Thomas A. Wassick | 1999-12-14 |