Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851911 | Semiconductor chip used in flip chip process | Bernt Julius Hansen, Ashwani K. Malhotra, David L. Questad, Wolfgang Sauter | 2010-12-14 |
| 7674637 | Monitoring cool-down stress in a flip chip process using monitor solder bump structures | Bernt Julius Hansen, Ashwani K. Malhotra, David L. Questad, Wolfgang Sauter | 2010-03-09 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-10-10 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-06-27 |
| 6677522 | Package for electronic component | Eric A. Johnson, Alfredo Migliore | 2004-01-13 |
| 5672260 | Process for selective application of solder to circuit packages | Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-09-30 |
| 5656139 | Electroplating apparatus | Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-08-12 |
| 5597469 | Process for selective application of solder to circuit packages | Kenneth Michael Fallon, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-01-28 |
| 5075965 | Low temperature controlled collapse chip attach process | Kenneth Michael Fallon, Rochelle Ginsburg, Charles G. Woychik | 1991-12-31 |