Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-10-10 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-06-27 |
| 6204074 | Chip design process for wire bond and flip-chip package | Allan Robert Bertolet, James Fiore | 2001-03-20 |