| 12064753 |
Metal oxide nanofibrous materials for photodegradation of environmental toxins |
Wayne E. Jones, Jian-Lin Liu, Julia B. Tollin, Danielle McCarthy, Emilly Obuya +1 more |
2024-08-20 |
|
| 11810893 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
Bing Dang, John U. Knickerbocker, Son K. Tran, Mario J. Interrante |
2023-11-07 |
$6,695,000 |
| 11049841 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
Bing Dang, Mario J. Interrante, John U. Knickerbocker, Son K. Tran |
2021-06-29 |
$5,149,000 |
| 10699972 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad |
2020-06-30 |
$3,003,000 |
| 10661261 |
Metal oxide nanofibrous materials for photodegradation of environmental toxins |
Wayne E. Jones, Jian-Lin Liu, Julia B. Tollin, Danielle McCarthy, Emilly Obuya +1 more |
2020-05-26 |
|
| 10459121 |
Increased thermal stabilization of optical absorbers |
Megan Fegley, Bradley Galusha, Francis D. Goroleski, Wayne E. Jones, Kenneth H. Skorenko |
2019-10-29 |
|
| 9920220 |
Conductive films and devices comprised thereof |
Nicholas A. Ravvin, Wayne E. Jones, Kenneth H. Skorenko |
2018-03-20 |
|
| 9915757 |
Increased thermal stabilization of optical absorbers |
Megan Fegley, Bradley Galusha, Francis D. Goroleski, Wayne E. Jones, Kenneth H. Skorenko |
2018-03-13 |
|
| 9899279 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad |
2018-02-20 |
$3,618,000 |
| 8957531 |
Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity |
Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad |
2015-02-17 |
$5,211,000 |
| 8444043 |
Uniform solder reflow fixture |
Marcus E. Interrante, Rajneesh Kumar, Chenzhou Lian, Janak G. Patel, Peter Slota, Jr. |
2013-05-21 |
$6,083,000 |
| 8167962 |
Pulpstone for long fiber pulp production |
Glen A. Smith |
2012-05-01 |
|
| 7566649 |
Compressible films surrounding solder connectors |
Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more |
2009-07-28 |
$11,761,000 |
| 7442878 |
Low stress conductive polymer bump |
Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more |
2008-10-28 |
$6,235,000 |
| 7332821 |
Compressible films surrounding solder connectors |
Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more |
2008-02-19 |
$12,555,000 |
| 7316572 |
Compliant electrical contacts |
David E. Eichstadt, Mukta G. Farooq, John U. Knickerbocker |
2008-01-08 |
$8,468,000 |
| 7170187 |
Low stress conductive polymer bump |
Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more |
2007-01-30 |
$4,520,000 |
| 7119003 |
Extension of fatigue life for C4 solder ball to chip connection |
Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more |
2006-10-10 |
$5,276,000 |
| 7067916 |
Extension of fatigue life for C4 solder ball to chip connection |
Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more |
2006-06-27 |
$5,894,000 |
| 6921015 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
Donald W. Henderson, James Spalik, Isabelle Paquin |
2005-07-26 |
$7,521,000 |
| 6585150 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
Donald W. Henderson, James Spalik, Isabelle Paquin |
2003-07-01 |
$13,647,000 |
| 6559666 |
Method and device for semiconductor testing using electrically conductive adhesives |
Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik |
2003-05-06 |
$19,022,000 |
| 6550667 |
Flux composition and soldering method for high density arrays |
Donald W. Henderson, James Spalik |
2003-04-22 |
$13,686,000 |
| 6492071 |
Wafer scale encapsulation for integrated flip chip and surface mount technology assembly |
Mark V. Pierson, Ajit K. Trivedi |
2002-12-10 |
$14,124,000 |
| 6425772 |
Conductive adhesive having a palladium matrix interface between two metal surfaces |
Edward G. Bundga |
2002-07-30 |
$10,205,000 |
