Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12064753 | Metal oxide nanofibrous materials for photodegradation of environmental toxins | Wayne E. Jones, Jian-Lin Liu, Julia B. Tollin, Danielle McCarthy, Emilly Obuya +1 more | 2024-08-20 |
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | Bing Dang, John U. Knickerbocker, Son K. Tran, Mario J. Interrante | 2023-11-07 |
| 11049841 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | Bing Dang, Mario J. Interrante, John U. Knickerbocker, Son K. Tran | 2021-06-29 |
| 10699972 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2020-06-30 |
| 10661261 | Metal oxide nanofibrous materials for photodegradation of environmental toxins | Wayne E. Jones, Jian-Lin Liu, Julia B. Tollin, Danielle McCarthy, Emilly Obuya +1 more | 2020-05-26 |
| 10459121 | Increased thermal stabilization of optical absorbers | Megan Fegley, Bradley Galusha, Francis D. Goroleski, Wayne E. Jones, Kenneth H. Skorenko | 2019-10-29 |
| 9920220 | Conductive films and devices comprised thereof | Nicholas A. Ravvin, Wayne E. Jones, Kenneth H. Skorenko | 2018-03-20 |
| 9915757 | Increased thermal stabilization of optical absorbers | Megan Fegley, Bradley Galusha, Francis D. Goroleski, Wayne E. Jones, Kenneth H. Skorenko | 2018-03-13 |
| 9899279 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2018-02-20 |
| 8957531 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | Timothy H. Daubenspeck, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2015-02-17 |
| 8444043 | Uniform solder reflow fixture | Marcus E. Interrante, Rajneesh Kumar, Chenzhou Lian, Janak G. Patel, Peter Slota, Jr. | 2013-05-21 |
| 8167962 | Pulpstone for long fiber pulp production | Glen A. Smith | 2012-05-01 |
| 7566649 | Compressible films surrounding solder connectors | Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2009-07-28 |
| 7442878 | Low stress conductive polymer bump | Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more | 2008-10-28 |
| 7332821 | Compressible films surrounding solder connectors | Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2008-02-19 |
| 7316572 | Compliant electrical contacts | David E. Eichstadt, Mukta G. Farooq, John U. Knickerbocker | 2008-01-08 |
| 7170187 | Low stress conductive polymer bump | Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon +1 more | 2007-01-30 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-10-10 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson, Pierre Langevin +3 more | 2006-06-27 |
| 6921015 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | Donald W. Henderson, James Spalik, Isabelle Paquin | 2005-07-26 |
| 6585150 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder | Donald W. Henderson, James Spalik, Isabelle Paquin | 2003-07-01 |
| 6559666 | Method and device for semiconductor testing using electrically conductive adhesives | Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik | 2003-05-06 |
| 6550667 | Flux composition and soldering method for high density arrays | Donald W. Henderson, James Spalik | 2003-04-22 |
| 6492071 | Wafer scale encapsulation for integrated flip chip and surface mount technology assembly | Mark V. Pierson, Ajit K. Trivedi | 2002-12-10 |
| 6425772 | Conductive adhesive having a palladium matrix interface between two metal surfaces | Edward G. Bundga | 2002-07-30 |