Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2009-07-28 |
| 7442878 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Roger A. Quon +1 more | 2008-10-28 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2008-02-19 |
| 7170187 | Low stress conductive polymer bump | William E. Bernier, Marie Cole, Mukta G. Farooq, John U. Knickerbocker, Roger A. Quon +1 more | 2007-01-30 |