Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12416513 | Actuator apparatus with light actuated position sensor and secure position verification | David A. Dahl, Robert Charles DeBlieck | 2025-09-16 |
| 12031851 | Actuator apparatus with light actuated position sensor and secure position verification | David A. Dahl, Robert Charles DeBlieck | 2024-07-09 |
| 7767575 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quinn +3 more | 2010-08-03 |
| 7572726 | Method of forming a bond pad on an I/C chip and resulting structure | Julie C. Biggs, Tien-Jen Cheng, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2009-08-11 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2009-07-28 |
| 7473997 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more | 2009-01-06 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, Mukta G. Farooq, John A. Fitzsimmons +4 more | 2008-02-19 |
| 7316572 | Compliant electrical contacts | William E. Bernier, Mukta G. Farooq, John U. Knickerbocker | 2008-01-08 |
| 7144490 | Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer | Tien-Jen Cheng, Jonathan H. Griffith, Sarah H. Knickerbocker, Rosemary A. Previti-Kelly, Roger A. Quon +2 more | 2006-12-05 |
| 6995475 | I/C chip suitable for wire bonding | Julie C. Biggs, Tien-Jen Cheng, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more | 2006-02-07 |
| 6995084 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more | 2006-02-07 |
| 6992389 | Barrier for interconnect and method | Panayotis Andricacos, Tien-Jen Cheng, Emanuel I. Cooper, Jonathan H. Griffith, Randolph F. Knarr +2 more | 2006-01-31 |
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, Stephen Kilpatrick, Henry A. Nye, III +1 more | 2005-05-31 |
| 6468413 | Electrochemical etch for high tin solder bumps | Lisa A. Fanti, John M. Cotte | 2002-10-22 |