David E. Eichstadt — 14 Patents at IBM

David E. Eichstadt has been granted 14 US patents while listed as an inventor at IBM. The first was granted in 2002 and the most recent in September 2025. David E. Eichstadt ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list David E. Eichstadt in Northbrook, IL, US.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12416513	Actuator apparatus with light actuated position sensor and secure position verification	David A. Dahl, Robert Charles DeBlieck	2025-09-16
12031851	Actuator apparatus with light actuated position sensor and secure position verification	David A. Dahl, Robert Charles DeBlieck	2024-07-09
7767575	Forming robust solder interconnect structures by reducing effects of seed layer underetching	Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quinn +3 more	2010-08-03
7572726	Method of forming a bond pad on an I/C chip and resulting structure	Julie C. Biggs, Tien-Jen Cheng, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more	2009-08-11	$14,264,000
7566649	Compressible films surrounding solder connectors	William E. Bernier, Tien-Jen Cheng, Marie Cole, Mukta G. Farooq, John A. Fitzsimmons +4 more	2009-07-28	$11,761,000
7473997	Method for forming robust solder interconnect structures by reducing effects of seed layer underetching	Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more	2009-01-06	$2,860,000
7332821	Compressible films surrounding solder connectors	William E. Bernier, Tien-Jen Cheng, Marie Cole, Mukta G. Farooq, John A. Fitzsimmons +4 more	2008-02-19	$12,555,000
7316572	Compliant electrical contacts	William E. Bernier, Mukta G. Farooq, John U. Knickerbocker	2008-01-08	$8,468,000
7144490	Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer	Tien-Jen Cheng, Jonathan H. Griffith, Sarah H. Knickerbocker, Rosemary A. Previti-Kelly, Roger A. Quon +2 more	2006-12-05	$6,328,000
6995475	I/C chip suitable for wire bonding	Julie C. Biggs, Tien-Jen Cheng, Lisa A. Fanti, Jonathan H. Griffith, Randolph F. Knarr +6 more	2006-02-07	$5,045,000
6995084	Method for forming robust solder interconnect structures by reducing effects of seed layer underetching	Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more	2006-02-07	$5,045,000
6992389	Barrier for interconnect and method	Panayotis Andricacos, Tien-Jen Cheng, Emanuel I. Cooper, Jonathan H. Griffith, Randolph F. Knarr +2 more	2006-01-31	$6,009,000
6900142	Inhibition of tin oxide formation in lead free interconnect formation	Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, Stephen Kilpatrick, Henry A. Nye, III +1 more	2005-05-31	$8,494,000
6468413	Electrochemical etch for high tin solder bumps	Lisa A. Fanti, John M. Cotte	2002-10-22	$16,060,000

David E. Eichstadt — 14 Patents

Issued Patents All Time

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