Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inhibition of tin oxide formation in lead free interconnect formation

Inhibition of tin oxide formation in lead free interconnect formation

US Patent 6900142 · Granted May 31, 2005

Estimated economic value: $8,494,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Actuator apparatus with light actuated position sensor and secure position verif2025
Electrical connections between dissimilar materials at cryogenic temperatures2025
Edge capacitive coupling for quantum chips2025
Downstop and bump bonds formation on substrates2024
Laser-assisted transdermal delivery of nanoparticulates and hydrogels2024
Actuator apparatus with light actuated position sensor and secure position verif2024
Create a protected layer for interconnects and devices in a packaged quantum str2024
Interposer chips and enclosures for quantum circuits2024
Combined backing plate and housing for use in bump bonded chip assembly2023
Combined backing plate and housing for use in bump bonded chip assembly2023
Laser-assisted transdermal delivery of nanoparticulates and hydrogels2023
Superconducting airbridge crossover using superconducting sacrificial material2022