Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12042222 | Laser-assisted transdermal delivery of nanoparticulates and hydrogels | Jerome M. Felsenstein, James L. Hedrick, James J. Wynne | 2024-07-23 |
| 11612433 | Laser-assisted transdermal delivery of nanoparticulates and hydrogels | Jerome M. Felsenstein, James L. Hedrick, James J. Wynne | 2023-03-28 |
| 11324552 | Laser-assisted transdermal delivery of nanoparticulates and hydrogels | Jerome M. Felsenstein, James L. Hedrick, James J. Wynne | 2022-05-10 |
| 10456197 | Laser-assisted transdermal delivery of nanoparticulates and hydrogels | Jerome M. Felsenstein, James L. Hedrick, James J. Wynne | 2019-10-29 |
| 10413359 | Laser-assisted transdermal delivery of nanoparticulates and hydrogels | Jerome M. Felsenstein, James L. Hedrick, James J. Wynne | 2019-09-17 |
| 9335346 | High performance compliant wafer test probe | S. Jay Chey, Dustin M. Fregeau, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh | 2016-05-10 |
| 8487304 | High performance compliant wafer test probe | S. Jay Chey, Dustin M. Fregeau, Aparna Prabhakar, Pavan Samudrala, Mohammed S. Shaikh | 2013-07-16 |
| 8026613 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-09-27 |
| 7923849 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2011-04-12 |
| 7863183 | Method for fabricating last level copper-to-C4 connection with interfacial cap structure | Timothy H. Daubenspeck, William Francis Landers | 2011-01-04 |
| 7410833 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Keith E. Fogel, Balaram Ghosal, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro +2 more | 2008-08-12 |
| 7312529 | Structure and method for producing multiple size interconnections | Lawrence A. Clevenger, Mukta G. Farooq, Louis L. Hsu, William Francis Landers, Carl Radens +1 more | 2007-12-25 |
| 6900142 | Inhibition of tin oxide formation in lead free interconnect formation | Emanual I. Cooper, John M. Cotte, Lisa A. Fanti, David E. Eichstadt, Stephen Kilpatrick +1 more | 2005-05-31 |