Issued Patents All Time
Showing 1–25 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10699972 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2020-06-30 |
| 10049897 | Extrusion-resistant solder interconnect structures and methods of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2018-08-14 |
| 9899279 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2018-02-20 |
| 9633962 | Plug via formation with grid features in the passivation layer | Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter | 2017-04-25 |
| 9613921 | Structure to prevent solder extrusion | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-04-04 |
| 9607862 | Extrusion-resistant solder interconnect structures and methods of forming | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-03-28 |
| 9397054 | Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-07-19 |
| 9331037 | Preventing misshaped solder balls | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-05-03 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-02-23 |
| 9257352 | Semiconductor test wafer and methods for use thereof | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2016-02-09 |
| 9230929 | Semiconductor structures and methods of manufacture | Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-01-05 |
| 9231046 | Capacitor using barrier layer metallurgy | Jeffrey P. Gambino, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter | 2016-01-05 |
| 9190318 | Method of forming an integrated crackstop | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-11-17 |
| 9165831 | Dice before grind with backside metal | Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-10-20 |
| 9165850 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-10-20 |
| 9159696 | Plug via formation by patterned plating and polishing | Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter | 2015-10-13 |
| 9105465 | Wafer edge conditioning for thinned wafers | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-08-11 |
| 9087754 | Structures and methods for improving solder bump connections in semiconductor devices | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-07-21 |
| 9059106 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-06-16 |
| 9040390 | Releasable buried layer for 3-D fabrication and methods of manufacturing | Steven E. Molis, Gordon C. Osborne, Jr., Wolfgang Sauter, Edmund J. Sprogis | 2015-05-26 |
| 9035459 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Harry D. Cox, Krystyna W. Semkow, Timothy D. Sullivan | 2015-05-19 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +3 more | 2015-04-28 |
| 9000585 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2015-04-07 |
| 8994173 | Solder bump connection and method of making | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2015-03-31 |
| 8957531 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Virendra R. Jadhav, Valerie Oberson, David L. Questad | 2015-02-17 |