Issued Patents All Time
Showing 51–75 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +3 more | 2014-01-28 |
| 8629557 | Structures and methods for detecting solder wetting of pedestal sidewalls | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-01-14 |
| 8592976 | Ball-limiting-metallurgy layers in solder ball structures | Charles L. Arvin, Wolfgang Sauter, Timothy D. Sullivan | 2013-11-26 |
| 8580673 | Underfill flow guide structures and method of using same | Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-11-12 |
| 8575007 | Selective electromigration improvement for high current C4s | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Thomas A. Wassick | 2013-11-05 |
| 8546253 | Self-aligned polymer passivation/aluminum pad | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-10-01 |
| 8513814 | Buffer pad in solder bump connections and methods of manufacture | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-20 |
| 8508043 | Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump | Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-13 |
| 8492892 | Solder bump connections | Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott | 2013-07-23 |
| 8492267 | Pillar interconnect chip to package and global wiring structure | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-07-23 |
| 8476762 | Ni plating of a BLM edge for Pb-free C4 undercut control | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-07-02 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Raschid J. Bezama, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott +6 more | 2013-05-21 |
| 8426247 | Polymer and solder pillars for connecting chip and carrier | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-23 |
| 8415260 | Chip identification for organic laminate packaging and methods of manufacture | Albert J. Banach, Wolfgang Sauter | 2013-04-09 |
| 8409980 | Underfill flow guide structures and method of using same | Jeffrey P. Gambino, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-02 |
| 8373275 | Fine pitch solder bump structure with built-in stress buffer | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-02-12 |
| 8361598 | Substrate anchor structure and method | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2013-01-29 |
| 8350383 | IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-01-08 |
| 8338947 | Solder interconnect pads with current spreading layers | Timothy D. Sullivan | 2012-12-25 |
| 8338286 | Dimensionally decoupled ball limiting metalurgy | Eric David Perfecto, Harry D. Cox, David L. Questad, Brian R. Sundlof | 2012-12-25 |
| 8298917 | Process for wet singulation using a dicing singulation structure | Paul S. Andry, Jeffrey P. Gambino, Edmund J. Sprogis, Cornelia K. Tsang | 2012-10-30 |
| 8298929 | Offset solder vias, methods of manufacturing and design structures | Gary LaFontant, Ekta Misra, David L. Questad, George J. Scott, Krystyna W. Semkow +3 more | 2012-10-30 |
| 8298930 | Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-10-30 |
| 8299568 | Damage propagation barrier | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2012-10-30 |
| 8299581 | Passivation layer extension to chip edge | Ekta Misra, Marie-Claude Paquet, Francis Santerre, Wolfgang Sauter | 2012-10-30 |