Issued Patents All Time
Showing 101–125 of 167 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7862987 | Method for forming an electrical structure comprising multiple photosensitive materials | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2011-01-04 |
| 7863734 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2011-01-04 |
| 7859122 | Final via structures for bond pad-solder ball interconnections | Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter | 2010-12-28 |
| 7843069 | Wire bond pads | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-11-30 |
| 7825511 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-11-02 |
| 7777339 | Semiconductor chips with reduced stress from underfill at edge of chip | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-08-17 |
| 7709876 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-05-04 |
| 7704804 | Method of forming a crack stop laser fuse with fixed passivation layer coverage | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-04-27 |
| 7682961 | Methods of forming solder connections and structure thereof | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2010-03-23 |
| 7635643 | Method for forming C4 connections on integrated circuit chips and the resulting devices | Mukta G. Farooq, Jeffrey P. Gambino, Christopher D. Muzzy, Kevin S. Petrarca, Wolfgang Sauter | 2009-12-22 |
| 7614147 | Method of creating contour structures to highlight inspection region | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-11-10 |
| 7601628 | Wire and solder bond forming methods | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-10-13 |
| 7547576 | Solder wall structure in flip-chip technologies | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-06-16 |
| 7545050 | Design structure for final via designs for chip stress reduction | Wolfgang Sauter, Jeffrey P. Gambino, David L. Questad | 2009-06-09 |
| 7541272 | Damascene patterning of barrier layer metal for C4 solder bumps | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-06-02 |
| 7521287 | Wire and solder bond forming methods | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-04-21 |
| 7521336 | Crack stop for low K dielectrics | Jeffrey P. Gambino, Stephen E. Luce, Thomas L. McDevitt, William T. Motsiff, Mark J. Pouliot +1 more | 2009-04-21 |
| 7517789 | Solder bumps in flip-chip technologies | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-04-14 |
| 7485564 | Undercut-free BLM process for Pb-free and Pb-reduced C4 | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-02-03 |
| 7482675 | Probing pads in kerf area for wafer testing | James W. Adkisson, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-01-27 |
| 7479447 | Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses | Christopher D. Muzzy, Paul S. McLaughlin, Judith A. Wright, Jean Wynne, Dae Young Jung | 2009-01-20 |
| 7462509 | Dual-sided chip attached modules | Kerry Bernstein, Timothy J. Dalton, Jeffrey P. Gambino, Mark D. Jaffe, Christopher D. Muzzy +3 more | 2008-12-09 |
| 7459785 | Electrical interconnection structure formation | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2008-12-02 |
| 7439170 | Design structure for final via designs for chip stress reduction | Wolfgang Sauter, Jeffrey P. Gambino, David L. Questad | 2008-10-21 |
| 7411135 | Contour structures to highlight inspection regions | Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2008-08-12 |