TD

Timothy H. Daubenspeck

IBM: 150 patents #285 of 70,183Top 1%
Globalfoundries: 14 patents #253 of 4,424Top 6%
UL Ultratech: 3 patents #25 of 110Top 25%
📍 Colchester, VT: #3 of 432 inventorsTop 1%
🗺 Vermont: #23 of 4,968 inventorsTop 1%
Overall (All Time): #4,967 of 4,157,543Top 1%
167
Patents All Time

Issued Patents All Time

Showing 151–167 of 167 patents

Patent #TitleCo-InventorsDate
6458630 Antifuse for use with low k dielectric foam insulators William A. Klaasen, William T. Motsiff, Rosemary A. Previti-Kelly, Jed H. Rankin 2002-10-01
6455914 Pedestal fuse Dennis P. Bouldin, William T. Motsiff 2002-09-24
6440834 Method and structure for a semiconductor fuse William T. Motsiff, Jed H. Rankin 2002-08-27
6426557 Self-aligned last-metal C4 interconnection layer for Cu technologies Stephen E. Luce, William T. Motsiff 2002-07-30
6375159 High laser absorption copper fuse and method for making the same William T. Motsiff 2002-04-23
6261873 Pedestal fuse Dennis P. Bouldin, William T. Motsiff 2001-07-17
6249038 Method and structure for a semiconductor fuse William T. Motsiff, Jed H. Rankin 2001-06-19
5935763 Self-aligned pattern over a reflective layer Michael Caterer, Thomas G. Ference, Edmund J. Sprogis 1999-08-10
5804464 Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore Kenneth E. Beilstein, Jr., Claude L. Bertin, Wayne J. Howell 1998-09-08
5793103 Insulated cube with exposed wire lead Thomas G. Ference, Steven J. Holmes 1998-08-11
5670428 Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same Kenneth E. Beilstein, Jr., Claude L. Bertin, Wayne J. Howell 1997-09-23
5644162 Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module Kenneth E. Beilstein, Jr., Claude L. Bertin, Wayne J. Howell 1997-07-01
5609772 Cube maskless lead open process using chemical mechanical polish/lead-tip expose process Steven J. Holmes, Thomas G. Ference 1997-03-11
5596226 Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module Kenneth E. Beilstein, Jr., Claude L. Bertin, Wayne J. Howell 1997-01-21
5219788 Bilayer metallization cap for photolithography John R. Abernathey, Stephen E. Luce, Denis J. Poley, Rosemary A. Previti-Kelly, Gary P. Viens +1 more 1993-06-15
4836887 Chlorofluorocarbon additives for enhancing etch rates in fluorinated halocarbon/oxidant plasmas Faith S. Ichishita 1989-06-06
4836886 Binary chlorofluorocarbon chemistry for plasma etching 1989-06-06