WH

Wayne J. Howell

IBM: 66 patents #1,150 of 70,183Top 2%
RS Robe Lighting S.R.O.: 1 patents #15 of 19Top 80%
Overall (All Time): #31,829 of 4,157,543Top 1%
67
Patents All Time

Issued Patents All Time

Showing 25 most recent of 67 patents

Patent #TitleCo-InventorsDate
12003097 Detecting and reporting the status of an overvoltage protection device 2024-06-04
7394268 Carrier for test, burn-in, and first level packaging Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, Jerzy M. Zalesinski +1 more 2008-07-01
7132841 Carrier for test, burn-in, and first level packaging Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, Jerzy M. Zalesinski +1 more 2006-11-07
6921018 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Thomas G. Ference 2005-07-26
6915795 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson 2005-07-12
6858941 Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Thomas G. Ference 2005-02-22
6806578 Copper pad structure Ronald L. Mendelson, William T. Motsiff 2004-10-19
6645789 On chip alpha-particle detector Kerry Bernstein, Andres Bryant, William A. Klaasen, Wilbur D. Pricer, Anthony K. Stamper 2003-11-11
6642080 Chip-on-chip interconnections of varied characterstics Thomas G. Ference, Edmund J. Sprogis 2003-11-04
6611050 Chip edge interconnect apparatus and method Thomas G. Ference, William R. Tonti, Richard Q. Williams 2003-08-26
6605526 Wirebond passivation pad connection using heated capillary Ronald L. Mendelson, William T. Motsiff, Jean-Guy Quintal, Sylvain Ouimet 2003-08-12
6600213 Semiconductor structure and package including a chip having chamfered edges Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson 2003-07-29
6559666 Method and device for semiconductor testing using electrically conductive adhesives William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2003-05-06
6545330 On chip alpha-particle detector Kerry Bernstein, Andres Bryant, William A. Klaasen, Wilbur D. Pricer, Anthony K. Stamper 2003-04-08
6455778 Micro-flex technology in semiconductor packages Claude L. Bertin, Thomas G. Ference, John A. Fifield 2002-09-24
6444490 Micro-flex technology in semiconductor packages Claude L. Bertin, Thomas G. Ference, John A. Fifield 2002-09-03
6426904 Structures for wafer level test and burn-in John E. Barth, Jr., Claude L. Bertin, Jeffrey H. Dreibelbis, Wayne F. Ellis, Erik L. Hedberg +3 more 2002-07-30
6426241 Method for forming three-dimensional circuitization and circuits formed Steven A. Cordes, Peter A. Gruber, James L. Speidell, Thomas G. Ference 2002-07-30
6410431 Through-chip conductors for low inductance chip-to-chip integration and off-chip connections Claude L. Bertin, William R. Tonti, Jerzy M. Zalesinski 2002-06-25
6358627 Rolling ball connector Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more 2002-03-19
6300687 Micro-flex technology in semiconductor packages Claude L. Bertin, Thomas G. Ference, John A. Fifield 2001-10-09
6294406 Highly integrated chip-on-chip packaging Claude L. Bertin, Thomas G. Ference, Edmund J. Sprogis 2001-09-25
6288559 Semiconductor testing using electrically conductive adhesives William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2001-09-11
6271102 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson 2001-08-07
6268739 Method and device for semiconductor testing using electrically conductive adhesives William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik 2001-07-31