| 12003097 |
Detecting and reporting the status of an overvoltage protection device |
— |
2024-06-04 |
|
| 7394268 |
Carrier for test, burn-in, and first level packaging |
Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, Jerzy M. Zalesinski +1 more |
2008-07-01 |
$7,630,000 |
| 7132841 |
Carrier for test, burn-in, and first level packaging |
Claude L. Bertin, Wayne F. Ellis, Mark W. Kellogg, William R. Tonti, Jerzy M. Zalesinski +1 more |
2006-11-07 |
$5,535,000 |
| 6921018 |
Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
Thomas G. Ference |
2005-07-26 |
$7,521,000 |
| 6915795 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson |
2005-07-12 |
$9,006,000 |
| 6858941 |
Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array |
Thomas G. Ference |
2005-02-22 |
$11,368,000 |
| 6806578 |
Copper pad structure |
Ronald L. Mendelson, William T. Motsiff |
2004-10-19 |
$7,667,000 |
| 6645789 |
On chip alpha-particle detector |
Kerry Bernstein, Andres Bryant, William A. Klaasen, Wilbur D. Pricer, Anthony K. Stamper |
2003-11-11 |
$12,741,000 |
| 6642080 |
Chip-on-chip interconnections of varied characterstics |
Thomas G. Ference, Edmund J. Sprogis |
2003-11-04 |
$11,371,000 |
| 6611050 |
Chip edge interconnect apparatus and method |
Thomas G. Ference, William R. Tonti, Richard Q. Williams |
2003-08-26 |
$17,117,000 |
| 6605526 |
Wirebond passivation pad connection using heated capillary |
Ronald L. Mendelson, William T. Motsiff, Jean-Guy Quintal, Sylvain Ouimet |
2003-08-12 |
$22,104,000 |
| 6600213 |
Semiconductor structure and package including a chip having chamfered edges |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson |
2003-07-29 |
$10,466,000 |
| 6559666 |
Method and device for semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik |
2003-05-06 |
$19,022,000 |
| 6545330 |
On chip alpha-particle detector |
Kerry Bernstein, Andres Bryant, William A. Klaasen, Wilbur D. Pricer, Anthony K. Stamper |
2003-04-08 |
$14,785,000 |
| 6455778 |
Micro-flex technology in semiconductor packages |
Claude L. Bertin, Thomas G. Ference, John A. Fifield |
2002-09-24 |
$8,983,000 |
| 6444490 |
Micro-flex technology in semiconductor packages |
Claude L. Bertin, Thomas G. Ference, John A. Fifield |
2002-09-03 |
$9,688,000 |
| 6426904 |
Structures for wafer level test and burn-in |
John E. Barth, Jr., Claude L. Bertin, Jeffrey H. Dreibelbis, Wayne F. Ellis, Erik L. Hedberg +3 more |
2002-07-30 |
$10,205,000 |
| 6426241 |
Method for forming three-dimensional circuitization and circuits formed |
Steven A. Cordes, Peter A. Gruber, James L. Speidell, Thomas G. Ference |
2002-07-30 |
$10,205,000 |
| 6410431 |
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections |
Claude L. Bertin, William R. Tonti, Jerzy M. Zalesinski |
2002-06-25 |
$16,651,000 |
| 6358627 |
Rolling ball connector |
Joseph A. Benenati, Claude L. Bertin, William T. Chen, Thomas Edward Dinan, Wayne F. Ellis +4 more |
2002-03-19 |
$20,987,000 |
| 6300687 |
Micro-flex technology in semiconductor packages |
Claude L. Bertin, Thomas G. Ference, John A. Fifield |
2001-10-09 |
$29,916,000 |
| 6294406 |
Highly integrated chip-on-chip packaging |
Claude L. Bertin, Thomas G. Ference, Edmund J. Sprogis |
2001-09-25 |
$32,998,000 |
| 6288559 |
Semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik |
2001-09-11 |
|
| 6271102 |
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
Donald W. Brouillette, Robert F. Cook, Thomas G. Ference, Eric G. Liniger, Ronald L. Mendelson |
2001-08-07 |
$22,988,000 |
| 6268739 |
Method and device for semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik |
2001-07-31 |
$29,242,000 |
