Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691248 | Methods for precise definition of integrated circuit chip edges | John Cronin, Howard L. Kalter, Patricia E. Marmillion, Anthony M. Palagonia, Bernadette Ann Pierson +1 more | 1997-11-25 |
| 5686843 | Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Dennis Charles Dubois, Gordon A. Kelley, Jr., Christopher P. Miller +4 more | 1997-11-11 |
| 5670428 | Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-09-23 |
| 5648684 | Endcap chip with conductive, monolithic L-connect for multichip stack | Claude L. Bertin, Howard L. Kalter | 1997-07-15 |
| 5644162 | Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-07-01 |
| 5614277 | Monolithic electronic modules--fabrication and structures | Kenneth E. Beilstein, Jr., Claude L. Bertin | 1997-03-25 |
| 5596226 | Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module | Kenneth E. Beilstein, Jr., Claude L. Bertin, Timothy H. Daubenspeck | 1997-01-21 |
| 5571754 | Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack | Claude L. Bertin, Howard L. Kalter | 1996-11-05 |
| 5567654 | Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging | Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, James M. Leas, David J. Perlman | 1996-10-22 |
| 5563086 | Integrated memory cube, structure and fabrication | Claude L. Bertin, Erik L. Hedberg, Howard L. Kalter, Gordon A. Kelley, Jr. | 1996-10-08 |
| 5561622 | Integrated memory cube structure | Claude L. Bertin, Erik L. Hedberg, Howard L. Kalter, Gordon A. Kelley, Jr. | 1996-10-01 |
| 5517754 | Fabrication processes for monolithic electronic modules | Kenneth E. Beilstein, Jr., Claude L. Bertin | 1996-05-21 |
| 5517057 | Electronic modules with interconnected surface metallization layers | Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, James M. Leas, Robert B. Phillips | 1996-05-14 |
| 5502667 | Integrated multichip memory module structure | Claude L. Bertin, Erik L. Hedberg, HOWARD KALTER, Gordon A. Kelley, Jr. | 1996-03-26 |
| 5502333 | Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit | Claude L. Bertin, Erik L. Hedberg | 1996-03-26 |
| 5478781 | Polyimide-insulated cube package of stacked semiconductor device chips | Claude L. Bertin, Paul A. Farrar, Christopher P. Miller, David J. Perlman | 1995-12-26 |
| 5466634 | Electronic modules with interconnected surface metallization layers and fabrication methods therefore | Kenneth E. Beilstein, Jr., Claude L. Bertin, John Cronin, James M. Leas, Robert B. Phillips | 1995-11-14 |